Known targets — ChEMBL curated mechanism
ACHEADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2ADRB3APH1AAPH1BCHRM2CHRM3EZH2GRIN2AHTR1AHTR1BHTR1DHTR1FHTR3ANCSTNP2RY12PSEN1PSEN2PSENENSIGMAR1SLC6A2SLC6A3SLC6A4
The experimentally established mechanism targets of Bromide. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TAS2R38 | P59533 | 3/20 | 0.52 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.52 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.52 |
| ▸ | TP53 | P04637 | 2/20 | 0.52 |
| ▸ | TSHR | P16473 | 2/20 | 0.52 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.52 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.52 |
| ▸ | CDK9 | P50750 | 1/20 | 0.52 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.52 |
| ▸ | CLK4 | Q9HAZ1 | 1/20 | 0.52 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.52 |
| ▸ | GAA | P10253 | 2/20 | 0.48 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.48 |
| ▸ | MEN1 | O00255 | 1/20 | 0.48 |
| ▸ | NPC1 | O15118 | 1/20 | 0.48 |
| ▸ | RAB9A | P51151 | 1/20 | 0.48 |
| ▸ | NOX1 | Q9Y5S8 | 1/20 | 0.48 |
| ▸ | TYR | P14679 | 1/20 | 0.48 |
| ▸ | NAPRT | Q6XQN6 | 1/20 | 0.48 |
| ▸ | POLB | P06746 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Benzene SCHEMBL27899223 | 0.97 | HSD17B10 (0.55) | TAS2R38HSD17B10ALDH1A1TP53TSHR | |
| SCHEMBL35172 | 0.97 | HSD17B10 (0.55) | TAS2R38HSD17B10ALDH1A1TP53TSHR | |
| SCHEMBL20163213 | 0.97 | HSD17B10 (0.55) | TAS2R38HSD17B10ALDH1A1TP53TSHR | |
| Hydrochloric Acid SCHEMBL5608654 | 0.94 | TAS2R38 (0.52) | TAS2R38HSD17B10ALDH1A1TP53TSHR | |
| Fluoride SCHEMBL20815438 | 0.94 | TAS2R38 (0.52) | TAS2R38HSD17B10ALDH1A1TP53TSHR | |
| Hydrogen Sulfide SCHEMBL28324183 | 0.94 | TAS2R38 (0.52) | TAS2R38HSD17B10ALDH1A1TP53TSHR | |
| SCHEMBL31160596 | 0.94 | TAS2R38 (0.52) | TAS2R38HSD17B10ALDH1A1TP53TSHR | |
| Hydrochloric Acid SCHEMBL11495422 | 0.92 | TAS2R38 (0.50) | TAS2R38HSD17B10ALDH1A1TP53TSHR | |
| SCHEMBL28711067 | 0.90 | HSD17B10 (0.50) | TAS2R38HSD17B10ALDH1A1TP53TSHR | |
| Guanidine SCHEMBL9137957 | 0.90 | ALDH1A1 (0.56) | TAS2R38HSD17B10ALDH1A1TP53TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 133 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117560942-A | Application of diphenyl guanidine hydrobromide serving as passivating agent in perovskite | 大连理工大学 | 2024-02-13 | — | — | CN | claimed |
| US-20120309866-A1 | SOLDER INK AND ELECTRONIC DEVICE PACKAGE USING SAME | DUK SAN TEKOPIA CO., LTD. (KR) | 2012-12-06 | — | — | US | claimed |
| US-20120228560-A1 | CONDUCTIVE ADHESIVE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME | DUK SAN TEKOPIA CO., LTD. (KR) | 2012-09-13 | — | — | US | claimed |
| US-20120067629-A1 | SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTRONIC DEVICE COMPRISING THE SAME | DUKSAN HI-METAL CO., LTD. (KR) | 2012-03-22 | — | — | US | claimed |
| EP-2412775-A2 | SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTRONIC DEVICE COMPRISING THE SAME | Duksan Hi-Metal Co., Ltd. (KR) | 2012-02-01 | — | — | EP | claimed |
| US-12515281-B2 | Flux | SENJU METAL INDUSTRY CO., LTD. (JP) | 2026-01-06 | — | — | US | disclosed |
| US-12427607-B2 | Flux and solder paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2025-09-30 | — | — | US | disclosed |
| US-20250286009-A1 | JOINING STRUCTURE AND JOINING MATERIAL FOR FORMING JOINING PART OF SAID JOINING STRUCTURE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2025-09-11 | — | — | US | disclosed |
| CN-120129582-A | Joint structure and joint material for forming joint of the joint structure | 松下知识产权经营株式会社 | 2025-06-10 | — | — | CN | disclosed |
| CN-119954713-A | Double-component luminous glass and preparation method and application thereof | 中山大学 | 2025-05-09 | — | — | CN | disclosed |
| CN-118176084-B | Soldering flux and method for producing bonded body | 千住金属工业株式会社 | 2025-03-18 | — | — | CN | disclosed |
| CN-119585071-A | Solder particles having active coating film formed thereon, and mixture and film for connection for manufacturing film for connection comprising same | 欧康博妮有限公司 | 2025-03-07 | — | — | CN | disclosed |
| US-20120067629-A1 | SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTRONIC DEVICE COMPRISING THE SAME | DUKSAN HI-METAL CO., LTD. (KR) | 2012-03-22 | — | — | US | disclosed |
| EP-2412775-A2 | SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTRONIC DEVICE COMPRISING THE SAME | Duksan Hi-Metal Co., Ltd. (KR) | 2012-02-01 | — | — | EP | disclosed |
| US-7357291-B2 | Solder metal, soldering flux and solder paste | SHOWA DENKO K.K. (JP) | 2008-04-15 | — | — | US | disclosed |
| US-20060071051-A1 | Solder metal, soldering flux and solder paste | SHOWA DENKO K.K. (JP) | 2006-04-06 | — | — | US | disclosed |
| US-6881278-B2 | Flux for solder paste | SHOWA DENKO K.K. (JP) | 2005-04-19 | — | — | US | disclosed |
| US-20030200836-A1 | Flux for solder paste | SHOWA DENKO K.K. | 2003-10-30 | — | — | US | disclosed |
| WO-2003064102-A1 | SOLDER METAL, SOLDERING FLUX AND SOLDER PASTE | SHOWA DENKO K.K. (JP) | 2003-08-07 | — | — | WO | disclosed |
| US-20020046627-A1 | Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product | SHOWA DENKO K.K. (JP) | 2002-04-25 | — | — | US | disclosed |