Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 8/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.40 |
| ▸ | MIF | P14174 | 1/20 | 0.35 |
| ▸ | EPHX2 | P34913 | 2/20 | 0.35 |
| ▸ | MAPT | P10636 | 2/20 | 0.34 |
| ▸ | POLB | P06746 | 1/20 | 0.34 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.34 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | PKM | P14618 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22263800 | 0.91 | KDM4E (0.38) | KDM4EALDH1A1MIFEPHX2POLB | |
| SCHEMBL22263786 | 0.90 | NAAA (0.44) | KDM4EALDH1A1EPHX2 | |
| SCHEMBL22263863 | 0.88 | NAAA (0.46) | KDM4EALDH1A1EPHX2LMNA | |
| SCHEMBL22263750 | 0.88 | NAAA (0.46) | KDM4EALDH1A1EPHX2LMNA | |
| SCHEMBL1089531 | 0.87 | KDM4E (0.41) | KDM4EALDH1A1EPHX2MAPTPOLB | |
| SCHEMBL13888501 | 0.84 | EPHX2 (0.35) | KDM4EALDH1A1EPHX2MAPTPOLB | |
| SCHEMBL5872938 | 0.80 | KDM4E (0.33) | KDM4EALDH1A1EPHX2POLBALOX15 | |
| SCHEMBL1087617 | 0.80 | EPHX2 (0.41) | KDM4EALDH1A1EPHX2MAPTPOLB | |
| SCHEMBL5359702 | 0.80 | KDM4E (0.39) | KDM4EALDH1A1EPHX2MAPTPOLB | |
| SCHEMBL4783612 | 0.79 | KDM4E (0.42) | KDM4EALDH1A1EPHX2MAPTPOLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11886119-B2 | Material for forming underlayer film, resist underlayer film, method of producing resist underlayer film, and laminate | MITSUI CHEMICALS, INC. (JP) | 2024-01-30 | — | — | US | disclosed |
| CN-110709774-B | Underlayer film forming material, resist underlayer film, method for producing resist underlayer film, and laminate | 三井化学株式会社 | 2023-12-08 | — | — | CN | disclosed |
| US-20230185195-A1 | MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE | MITSUI CHEMICALS, INC. (JP) | 2023-06-15 | — | — | US | disclosed |
| US-11599025-B2 | Resin material for forming underlayer film, resist underlayer film, method of producing resist underlayer film, and laminate | MITSUI CHEMICALS, INC. (JP) | 2023-03-07 | — | — | US | disclosed |
| US-20200264511-A1 | MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE | MITSUI CHEMICALS, INC. (JP) | 2020-08-20 | — | — | US | disclosed |
| EP-3693793-A1 | RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR PRODUCING RESIST UNDERLAYER FILM, AND LAYERED PRODUCT | Mitsui Chemicals, Inc. (JP) | 2020-08-12 | — | — | EP | disclosed |
| US-20200241419-A1 | RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE | MITSUI CHEMICALS, INC. (JP) | 2020-07-30 | — | — | US | disclosed |
| CN-111183395-A | Resin material for forming underlayer film, resist underlayer film, method for producing resist underlayer film, and laminate | 三井化学株式会社 | 2020-05-19 | — | — | CN | disclosed |
| CN-110709774-A | Material for forming underlayer film, resist underlayer film, method for producing resist underlayer film, and laminate | 三井化学株式会社 | 2020-01-17 | — | — | CN | disclosed |
| US-20080199805-A1 | PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES | FUJIFILM ELECTRONIC MATERIALS. U.S.A., INC. | 2008-08-21 | — | — | US | disclosed |
| WO-2008098189-A1 | PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-14 | — | — | WO | disclosed |