SCHEMBL4740532

SCHEMBL4740532

CCC(C)C(=O)OOC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5427965 0.87 ALDH1A1 (0.36)
SCHEMBL9634959 0.81 CA1 (0.39)
SCHEMBL7924470 0.80 POLB (0.33)
Methyl 2-Methylbutanoate SCHEMBL8954886 0.79
Methyl 2-Methylbutanoate SCHEMBL283261 0.79
Methyl 2-Methylbutanoate SCHEMBL1869834 0.79 CA1 (0.46)
Methyl 2-Methylbutanoate SCHEMBL108113 0.79
SCHEMBL11746994 0.78 ALDH1A1 (0.40)
SCHEMBL332266 0.78 ALDH1A1 (0.36)
SCHEMBL17394852 0.78 CA1 (0.50)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10663863-B2 Method of producing layer structure, and method of forming patterns SAMSUNG SDI CO., LTD. (KR) 2020-05-26 US claimed
US-10312074-B2 Method of producing layer structure, layer structure, and method of forming patterns SAMSUNG SDI CO., LTD. (KR) 2019-06-04 US claimed
US-20170115572-A1 METHOD OF PRODUCING LAYER STRUCTURE, AND METHOD OF FORMING PATTERNS SAMSUNG SDI CO., LTD. (KR) 2017-04-27 US claimed
US-20160126088-A1 METHOD OF PRODUCING LAYER STRUCTURE, LAYER STRUCTURE, AND METHOD OF FORMING PATTERNS SAMSUNG SDI CO., LTD. (KR) 2016-05-05 US claimed
US-20230129965-A1 HYDROPHILIC AND OLEOPHOBIC POLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2023-04-27 US disclosed
US-10663863-B2 Method of producing layer structure, and method of forming patterns SAMSUNG SDI CO., LTD. (KR) 2020-05-26 US disclosed
CN-105575775-B Layer structure and the method and semiconductor device for manufacturing its method, forming pattern 三星SDI株式会社 2019-08-13 CN disclosed
US-10312074-B2 Method of producing layer structure, layer structure, and method of forming patterns SAMSUNG SDI CO., LTD. (KR) 2019-06-04 US disclosed
US-20180030175-A1 POLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2018-02-01 US disclosed
CN-106610567-A Method for producing layer structure, and method for forming patterns 三星SDI株式会社 2017-05-03 CN disclosed
US-20170115572-A1 METHOD OF PRODUCING LAYER STRUCTURE, AND METHOD OF FORMING PATTERNS SAMSUNG SDI CO., LTD. (KR) 2017-04-27 US disclosed
US-20160126088-A1 METHOD OF PRODUCING LAYER STRUCTURE, LAYER STRUCTURE, AND METHOD OF FORMING PATTERNS SAMSUNG SDI CO., LTD. (KR) 2016-05-05 US disclosed
WO-2008088217-A2 METHOD FOR PROTECTING A HEAT EXCHANGER AGAINST CORROSION, AND HEAT EXCHANGER AND LIQUID COMPOSITION FOR PROTECTING A HEAT EXCHANGER AGAINST CORROSION TRIPLE E B.V. (NL) 2008-07-24 WO disclosed
EP-1812381-A1 ETHYLENICALLY UNSATURATED GROUP-CONTAINING ISOCYANATE COMPOUND AND PROCESS FOR PRODUCING THE SAME, AND REACTIVE MONOMER, REACTIVE (METH)ACRYLATE POLYMER AND ITS USE SHOWA DENKO KABUSHIKI KAISHA (JP) 2007-08-01 EP disclosed
WO-2006049264-A1 ETHYLENICALLY UNSATURATED GROUP-CONTAINING ISOCYANATE COMPOUND AND PROCESS FOR PRODUCING THE SAME, AND REACTIVE MONOMER, REACTIVE (METH)ACRYLATE POLYMER AND ITS USE SHOWA DENKO K.K. (JP) 2006-05-11 WO disclosed