SCHEMBL47527

SCHEMBL47527

CC1C2CC(CCO)C(C2)C1C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL47483 0.88
SCHEMBL13319485 0.86
SCHEMBL47544 0.82 GBA1 (0.30)
SCHEMBL13714724 0.82 GBA1 (0.30)
SCHEMBL47572 0.81 TSHR (0.34)
SCHEMBL24772279 0.79
SCHEMBL13609005 0.76 ALOX5 (0.36)
SCHEMBL24772282 0.76
SCHEMBL17123459 0.75
SCHEMBL12230474 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9897922-B2 Method of forming pattern and developer for use in the method FUJIFILM CORPORATION (JP) 2018-02-20 US disclosed
US-20170102618-A1 METHOD OF FORMING PATTERN FUJIFILM CORPORATION (JP) 2017-04-13 US disclosed
US-20160349620-A1 METHOD OF FORMING PATTERN AND DEVELOPER FOR USE IN THE METHOD FUJIFILM CORPORATION (JP) 2016-12-01 US disclosed
US-9482958-B2 Method of forming pattern and developer for use in the method FUJIFILM CORPORATION (JP) 2016-11-01 US disclosed
US-9223219-B2 Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition and resist film FUJIFILM CORPORATION (JP) 2015-12-29 US disclosed
US-20150293454-A1 METHOD OF FORMING PATTERN AND DEVELOPER FOR USE IN THE METHOD FUJIFILM CORPORATION (JP) 2015-10-15 US disclosed
US-9097973-B2 Method of forming pattern and developer for use in the method FUJIFILM CORPORATION (JP) 2015-08-04 US disclosed
US-8999621-B2 Pattern forming method, chemical amplification resist composition and resist film FUJIFILM CORPORATION (JP) 2015-04-07 US disclosed
US-8871642-B2 Method of forming pattern and developer for use in the method FUJIFILM CORPORATION (JP) 2014-10-28 US disclosed
US-8859187-B2 Method of forming resist pattern and negative resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2014-10-14 US disclosed
US-20100081088-A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND AND ACID GENERATOR INCLUDING THE SAME TOKYO OHKA KOGYO CO., LTD. (JP) 2010-04-01 US disclosed
US-20100062379-A1 METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-03-11 US disclosed
US-20100035192-A1 METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-02-11 US disclosed
US-20100035178-A1 Negative resist composition, method of forming resist pattern and polymeric compound TOKYO OHKA KOGYO CO., LTD. 2010-02-11 US disclosed
US-20090274976-A1 Negative resist composition for immersion exposure and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2009-11-05 US disclosed
US-7598017-B2 Negative resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2009-10-06 US disclosed
US-20090191478-A1 METHOD OF FORMING RESIST PATTERN AND NEGATIVE RESIST COMPOSITION TOKYO OHKA KOGYO CO., LTD (JP) 2009-07-30 US disclosed
US-20090111054-A1 NEGATIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-04-30 US disclosed
US-20090087799-A1 ANTIREFLECTIVE COATING COMPOSITION, ANTIREFLECTIVE COATING, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-04-02 US disclosed
US-7416833-B2 Photoresist undercoat-forming material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-08-26 US disclosed