Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3580782 | 0.88 | TSHR (0.36) | TSHR | |
| SCHEMBL27900310 | 0.82 | TSHR (0.31) | TSHR | |
| SCHEMBL21808345 | 0.80 | TSHR (0.34) | TSHR | |
| SCHEMBL15257113 | 0.80 | TSHR (0.39) | TSHRHPGD | |
| SCHEMBL21517645 | 0.76 | TSHR (0.32) | TSHR | |
| SCHEMBL28034445 | 0.76 | TSHR (0.36) | TSHRHPGD | |
| SCHEMBL1403558 | 0.76 | TSHR (0.36) | TSHR | |
| SCHEMBL16694105 | 0.76 | TSHR (0.36) | TSHRHPGD | |
| SCHEMBL21014820 | 0.74 | TSHR (0.35) | TSHR | |
| SCHEMBL3673989 | 0.74 | POLB (0.40) | TSHRHPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20210147631-A1 | PHOTOPATTERNED PLANARIZATION LAYERS FOR FLEXIBLE ELECTRONICS | ARES Materials, Inc. | 2021-05-20 | — | — | US | claimed |
| US-11822243-B2 | Negative-type photosensitive resin composition, cured film, element and display device provided with cured film, and production method therefor | TORAY INDUSTRIES, INC. (JP) | 2023-11-21 | — | — | US | disclosed |
| US-11667111-B2 | Method for forming flexible cover lens films | ARES MATERIALS INC. (US) | 2023-06-06 | — | — | US | disclosed |
| US-20200123410-A1 | METHOD FOR FORMING FLEXIBLE COVER LENS FILMS | ARES MATERIALS INC. | 2020-04-23 | — | — | US | disclosed |
| US-10615191-B2 | Polymer substrate for flexible electronics microfabrication and methods of use | ARES MATERIALS INC. (US) | 2020-04-07 | — | — | US | disclosed |
| US-20190258164-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY DEVICE PROVIDED WITH CURED FILM, AND PRODUCTION METHOD THEREFOR | TORAY INDUSTRIES, INC. (JP) | 2019-08-22 | — | — | US | disclosed |
| EP-2135136-B1 | STEREOLITHOGRAPHY RESIN COMPOSITIONS AND THREE-DIMENSIONAL OBJECTS MADE THEREFROM | DSM IP ASSETS BV (NL) | 2018-10-17 | — | — | EP | disclosed |
| US-20180208829-A1 | Novel Thiol-ene based resin system for sand consolidation and methods using thereof | HALLIBURTON ENERGY SERVICES, INC. (US) | 2018-07-26 | — | — | US | disclosed |
| US-20170338254-A1 | POLYMER SUBSTRATE FOR FLEXIBLE ELECTRONICS MICROFABRICATION AND METHODS OF USE | ARES MATERIALS INC. | 2017-11-23 | — | — | US | disclosed |
| US-9377686-B2 | Photosensitive resin composition, conductive wire protection film, and touch panel member | TORAY INDUSTRIES, INC. (JP) | 2016-06-28 | — | — | US | disclosed |
| EP-1667506-A1 | Electroless plating solution, electroless plating process, and printed circuit board | Ibiden Co., Ltd. (JP) | 2006-06-07 | — | — | EP | disclosed |
| EP-1667504-A1 | Process for manufacturing a multilayer printed circuit board, and multilayer printed circuit board | IBIDEN CO., LTD. (JP) | 2006-06-07 | — | — | EP | disclosed |
| US-6881532-B2 | Method of processing light sensitive planographic printing plate precursor and pre-washing solution used in the method | KONICA CORPORATION (JP) | 2005-04-19 | — | — | US | disclosed |
| US-6794120-B2 | PHOTOPOLYMERIZATION OF ETHYLENICALLY UNSATURATED COMPOUND IN PRESENCE OF PHOTOINITIATOR AND BINDER; IMAGING, PRE-WASHING; DEVELOPMENT WITH ALKALI METAL COMPOUND | KONICA CORPORATION (JP) | 2004-09-21 | — | — | US | disclosed |
| US-20040134682-A1 | Printed wiring board and its manufacturing method | IBIDEN CO., LTD. | 2004-07-15 | — | — | US | disclosed |
| US-20040131974-A1 | Method of processing light sensitive planographic printing plate precursor | KONICA CORPORATION (JP) | 2004-07-08 | — | — | US | disclosed |
| US-6730455-B2 | DEVELOPING A PRESENSITIZED PLATE COMPRISING A PHOTO-POLYMERIZABLE LIGHT SENSITIVE LAYER WITH A LIQUID DEVELOPER TO FORM A NEGATIVE IMAGE; INCLUDES AN OXYGEN SHIELDING LAYER CONTAINING POLYVINYL ALCOHOL AND POLYVINYL PYRROLIDONE | KONICA CORPORATION (JP) | 2004-05-04 | — | — | US | disclosed |
| EP-1388760-A1 | Method of processing light sensitive planographic printing plate precursor | KONICA CORPORATION (JP) | 2004-02-11 | — | — | EP | disclosed |
| US-20030113667-A1 | Method of preparing planographic printing plate | FUJIFILM CORPORATION (JP) | 2003-06-19 | — | — | US | disclosed |
| EP-1117283-A1 | PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD | IBIDEN CO., LTD. (JP) | 2001-07-18 | — | — | EP | disclosed |