Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FFAR3 | O14843 | 2/20 | 0.35 |
| ▸ | HDAC3 | O15379 | 2/20 | 0.35 |
| ▸ | HDAC1 | Q13547 | 2/20 | 0.35 |
| ▸ | HDAC2 | Q92769 | 2/20 | 0.35 |
| ▸ | HDAC8 | Q9BY41 | 2/20 | 0.35 |
| ▸ | CES2 | O00748 | 1/20 | 0.33 |
| ▸ | CES1 | P23141 | 1/20 | 0.33 |
| ▸ | CA1 | P00915 | 2/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.32 |
| ▸ | TSHR | P16473 | 2/20 | 0.32 |
| ▸ | NFKB1 | P19838 | 2/20 | 0.32 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.32 |
| ▸ | LMNA | P02545 | 2/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28564718 | 0.84 | FFAR3 (0.34) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| Butyric Acid SCHEMBL5585989 | 0.81 | FFAR3 (0.58) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| SCHEMBL6138485 | 0.80 | FFAR3 (0.48) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| SCHEMBL50797 | 0.75 | FFAR3 (0.40) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| SCHEMBL10518892 | 0.75 | TSHR (0.32) | TSHR | |
| Propionic Acid SCHEMBL7105055 | 0.74 | CA2 (0.37) | FFAR3HDAC3HDAC1HDAC2HDAC8 | |
| SCHEMBL22557967 | 0.73 | CA2 (0.44) | CA1CYP3A4TSHRNFKB1NPSR1 | |
| SCHEMBL28558317 | 0.73 | — | — | |
| L-Lactic Acid SCHEMBL7041762 | 0.72 | TP53 (0.35) | TSHR | |
| Acetic Acid SCHEMBL16110535 | 0.71 | CA1 (0.44) | CA1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1683821-B1 | Composite particles and production process thereof, aqueous dispersion composition for chemical polishing, and process for manufacture of semiconductor device | JSR CORP (JP) | 2013-01-02 | — | — | EP | disclosed |
| EP-1020488-B1 | Composite particles and production process thereof, aqueous dispersion composition for chemical polishing, and process for manufacture of semiconductor device | TOSHIBA KK (JP) | 2008-12-31 | — | — | EP | disclosed |
| EP-1683821-A1 | Composite particles and production process thereof, aqueous dispersion composition for chemical polishing, and process for manufacture of semiconductor device | JSR Corporation (JP) | 2006-07-26 | — | — | EP | disclosed |
| EP-1058274-B1 | Composition for film formation and material for insulating film formation | JSR CORP (JP) | 2005-07-27 | — | — | EP | disclosed |
| EP-1036836-B1 | Aqueous dispersion for chemical mechanical polishing | TOSHIBA KK (JP) | 2004-11-03 | — | — | EP | disclosed |
| US-6740590-B1 | AQUEOUS DISPERSION, AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USED FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, AND METHOD FOR FORMATION OF EMBEDDED WRITING | KABUSHIKI KAISHA TOSHIBA (JP) | 2004-05-25 | — | — | US | disclosed |
| US-6454819-B1 | POLYMER PARTICLES HAVING A SILOXANE BOND-COUPLING SECTION AND A METAL COMPOUND SECTION ON SAID POLYMER PARTICLES; METALLOXANE BOND-CONTAINING SECTION, ALUMINA, CERIA, OR ZIRCONIA PARTICLE; STRENGTH, HEAT RESISTANCE | KABUSHIKI KAISHA TOSHIBA (JP) | 2002-09-24 | — | — | US | disclosed |
| US-6376634-B1 | ORGANOSILICON POLYMERS | JSR CORPORATION (JP) | 2002-04-23 | — | — | US | disclosed |
| US-6235101-B1 | SILICON HYDROLYZATE, METAL CHELATE, ORGANIC SOLVENT AND BETA DIKETONE FOR FILMS | JSR CORPORATION (JP) | 2001-05-22 | — | — | US | disclosed |
| EP-1058274-A1 | Composition for film formation and material for insulating film formation | JSR Corporation (JP) | 2000-12-06 | — | — | EP | disclosed |
| EP-1036836-A1 | Aqueous dispersion for chemical mechanical polishing | KABUSHIKI KAISHA TOSHIBA (JP) | 2000-09-20 | — | — | EP | disclosed |
| EP-1020488-A2 | Composite particles and production process thereof, aqueous dispersion composition for chemical polishing, and process for manufacture of semiconductor device | Kabushiki Kaisha Toshiba (JP) | 2000-07-19 | — | — | EP | disclosed |
| EP-0921561-A2 | Composition for film formation and film | JSR Corporation (JP) | 1999-06-09 | — | — | EP | disclosed |