Butyric Acid

Butyric Acid

SCHEMBL5585989

CC(C)O[Ti+2]OC(C)C.CCCC(=O)[O-].CCCC(=O)[O-]

nearest known ligand 0.58

Full drug profile on Sugi Atlas →

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
FFAR3 O14843 2/20 0.58
HDAC3 O15379 2/20 0.58
HDAC1 Q13547 2/20 0.58
HDAC2 Q92769 2/20 0.58
HDAC8 Q9BY41 2/20 0.58
CA1 P00915 3/20 0.41
NFKB1 P19838 1/20 0.40
GPR84 Q9NQS5 1/20 0.39
CES2 O00748 1/20 0.39
CES1 P23141 1/20 0.39
CA2 P00918 2/20 0.37
BBOX1 O75936 3/20 0.36
ALDH1A1 P00352 1/20 0.34
LMNA P02545 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL50797 0.85 FFAR3 (0.40) FFAR3HDAC3HDAC1HDAC2HDAC8
Propionic Acid SCHEMBL7105055 0.85 CA2 (0.37) FFAR3HDAC3HDAC1HDAC2HDAC8
SCHEMBL4769708 0.81 FFAR3 (0.35) FFAR3HDAC3HDAC1HDAC2HDAC8
Butyric Acid SCHEMBL1035581 0.79 FFAR3 (0.82) FFAR3HDAC3HDAC1HDAC2HDAC8
Oleic Acid SCHEMBL20543635 0.76 FABP3 (0.69) LMNA
SCHEMBL22557967 0.75 CA2 (0.44) CA1NFKB1CA2
Butyric Acid SCHEMBL2230696 0.75 FFAR3 (0.74) FFAR3HDAC3HDAC1HDAC2HDAC8
Butyric Acid SCHEMBL8027476 0.75 FFAR3 (0.74) FFAR3HDAC3HDAC1HDAC2HDAC8
Butyric Acid SCHEMBL8027475 0.75 FFAR3 (0.74) FFAR3HDAC3HDAC1HDAC2HDAC8
Butyric Acid SCHEMBL30879925 0.75 FFAR3 (0.74) FFAR3HDAC3HDAC1HDAC2HDAC8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-03-05 US disclosed
WO-2024219463-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND CURED FILM 旭化成株式会社 2024-10-24 WO disclosed
WO-2024210063-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, CURED FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2024-10-10 WO disclosed
WO-2024095927-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME 旭化成株式会社 2024-05-10 WO disclosed
WO-2024090567-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM 旭化成株式会社 2024-05-02 WO disclosed
EP-2607444-B1 RESIN FOR OXYGEN-ABSORBING ADHESIVE AND OXYGEN-ABSORBING ADHESIVE TOYO SEIKAN KAISHA LTD (JP) 2019-05-01 EP disclosed
CN-108779352-A Low-emission liquid film for building sealing SIKA技术股份公司 2018-11-09 CN disclosed
CN-108699218-A Curable compositions SIKA技术股份公司 2018-10-23 CN disclosed
US-9428316-B2 Resin for oxygen-absorbing adhesive and oxygen-absorbing adhesive TOYO SEIKAN GROUP HOLDINGS, LTD. (JP) 2016-08-30 US disclosed
US-20150125710-A1 Resin for Oxygen-absorbing Adhesive and Oxygen-absorbing Adhesive TOYO SEIKAN GROUP HOLDINGS, LTD. (JP) 2015-05-07 US disclosed
EP-2607444-A1 RESIN FOR OXYGEN-ABSORBING ADHESIVE AND OXYGEN-ABSORBING ADHESIVE Toyo Seikan Kaisha, Ltd. (JP) 2013-06-26 EP disclosed
US-20130143734-A1 Resin for Oxygen-absorbing Adhesive and Oxygen-absorbing Adhesive TOYO SEIKAN KAISHA LTD. (JP) 2013-06-06 US disclosed
US-20070298190-A1 Method of Producing Metal Oxide Film DAI NIPPON PRINTING CO., LTD. (JP) 2007-12-27 US disclosed
EP-0965618-B1 Photo-curable composition and photo-cured product JSR CORP (JP) 2004-01-02 EP disclosed
US-6207728-B1 COMPOSITION COMPRISING BOTH HYDROLYZABLE SILANE COMPOUND AND HYDROLYZATE THEREOF OR EITHER ONE, PHOTO ACID GENERATOR, DEHYDRATING AGENT JSR CORPORATION (JP) 2001-03-27 US disclosed
EP-0965618-A1 Photo-curable composition and photo-cured product JSR Corporation (JP) 1999-12-22 EP disclosed
US-5998072-A Electrophotographic photoreceptor, and an image-forming method and apparatus for using the same KONICA CORPORATION (JP) 1999-12-07 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 FFAR3 988/4885HDAC3 4069/4885HDAC1 1766/4885
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ARCN1, PBRM1, LCP1 FFAR3 2433/4885HDAC3 3640/4885HDAC1 1700/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.