SCHEMBL4782579

SCHEMBL4782579

CCCCOCCOC(C)CC(=O)O

nearest known ligand 0.41

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.41
CYP3A4 P08684 1/20 0.40
RARB P10826 1/20 0.39
GPR84 Q9NQS5 4/20 0.38
MAPT P10636 2/20 0.37
MEN1 O00255 1/20 0.37
THRB P10828 1/20 0.37
HTT P42858 1/20 0.37
KMT2A Q03164 1/20 0.37
HSD17B10 Q99714 1/20 0.37
EPHX2 P34913 1/20 0.36
MMP9 P14780 1/20 0.35
MMP8 P22894 1/20 0.35
MMP13 P45452 1/20 0.35
ALDH1A1 P00352 1/20 0.35
CES2 O00748 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2015252 0.89 GPR84 (0.42) TSHRGPR84MMP9MMP8MMP13
SCHEMBL28521529 0.89 GPR84 (0.42) TSHRGPR84MMP9MMP8MMP13
SCHEMBL5666813 0.83 ALDH1A1 (0.42) TSHRTHRBHSD17B10ALDH1A1
SCHEMBL14252257 0.82 TSHR (0.41) TSHRCYP3A4RARBGPR84MAPT
SCHEMBL21876833 0.81 ALDH1A1 (0.35) MEN1KMT2AHSD17B10ALDH1A1
SCHEMBL5454693 0.81 TSHR (0.39) TSHRCYP3A4RARBGPR84MAPT
SCHEMBL3788751 0.81 GPR84 (0.36) GPR84HSD17B10
SCHEMBL5486588 0.79 MAPT (0.38) TSHRCYP3A4RARBMAPTMEN1
SCHEMBL12544466 0.79 MAPT (0.38) TSHRCYP3A4RARBMAPTMEN1
SCHEMBL6914851 0.79 LPAR1 (0.47) TSHRCYP3A4RARBALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117580909-A Conductive resin composition, high thermal conductive material, and semiconductor device 住友电木株式会社 2024-02-20 CN disclosed
CN-117461120-A Conductive paste, cured product, and semiconductor device 住友电木株式会社 2024-01-26 CN disclosed
CN-117098806-A Conductive resin composition, high thermal conductive material, and semiconductor device 住友电木株式会社 2023-11-21 CN disclosed
CN-116547357-A Silver-containing paste and bonded body 住友电木株式会社 2023-08-04 CN disclosed
CN-114341288-B Thermally conductive composition and semiconductor device 住友电木株式会社 2023-07-28 CN disclosed
US-9221019-B2 Organic/inorganic hybrid compound for fouling resistance, membrane including the same for fouling resistance, and method of preparing membrane for fouling resistance SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-12-29 US disclosed
US-20130020243-A1 SEPARATION MEMBRANE, METHOD FOR MANUFACTURING THE SAME, AND WATER TREATMENT DEVICE INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2013-01-24 US disclosed
EP-2548631-A1 Cellulose-ether-ester support for forward osmosis membrane Samsung Electronics Co., Ltd. (KR) 2013-01-23 EP disclosed
US-20120298574-A1 Organic/Inorganic Hybrid Compound For Fouling Resistance, Membrane Including The Same For Fouling Resistance, And Method Of Preparing Membrane For Fouling Resistance SNU R&DB FOUNDATION (KR) 2012-11-29 US disclosed
US-20120261321-A1 SEPARATION MEMBRANE, METHOD FOR MANUFACTURING THE SAME, AND FORWARD OSMOSIS DEVICE INCLUDING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-10-18 US disclosed
WO-2008058553-A1 GAS SENSOR AND GAS-SENSITIVE METAL OXIDE POWDER PIRELLI & C. S.P.A. (IT) 2008-05-22 WO disclosed
EP-0018601-B1 ANTISTATIC COATING COMPOSITIONS AND ELEMENTS EASTMAN KODAK COMPANY (a New Jersey corporation) (US) 1983-01-12 EP disclosed
US-4294739-A COATINGS, PHOTOGRAPHIC ELEMENTS EASTMAN KODAK COMPANY (US) 1981-10-13 US disclosed
EP-0018601-A1 Antistatic coating compositions and elements EASTMAN KODAK COMPANY (a New Jersey corporation) (US) 1980-11-12 EP disclosed