SCHEMBL4783448

SCHEMBL4783448

CCCC(C)c1c(O)cccc1-c1ccc(O)cc1

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ABL1 P00519 2/20 0.36
ABCB1 P08183 2/20 0.36
BCR P11274 2/20 0.36
TSHR P16473 1/20 0.36
ESR1 P03372 5/20 0.35
ESR2 Q92731 5/20 0.35
LTB4R2 Q9NPC1 1/20 0.34
ALDH1A1 P00352 2/20 0.34
HPGD P15428 2/20 0.34
HSD17B10 Q99714 2/20 0.34
POLB P06746 1/20 0.34
MAPT P10636 1/20 0.34
BACE1 P56817 1/20 0.34
HDAC4 P56524 1/20 0.33
HDAC2 Q92769 1/20 0.33
HDAC8 Q9BY41 1/20 0.33
USP7 Q93009 1/20 0.33
HSD17B1 P14061 1/20 0.33
HSD17B2 P37059 1/20 0.33
TAAR1 Q96RJ0 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6325213 0.81 TSHR (0.47) TSHRALDH1A1HPGDHSD17B10MAPT
SCHEMBL23877934 0.80 ESR2 (0.45) ABL1ABCB1BCRESR1ESR2
SCHEMBL9563375 0.78 ABL1 (0.42) ABL1ABCB1BCRTSHRESR1
SCHEMBL9563371 0.78 ABL1 (0.42) ABL1ABCB1BCRTSHRESR1
SCHEMBL676779 0.75 TSHR (0.50) TSHRALDH1A1HPGDPOLBMAPT
SCHEMBL10356132 0.74 HPGD (0.43) TSHRESR1ESR2ALDH1A1HPGD
SCHEMBL23045158 0.71 PDE4A (0.39) ABL1ABCB1BCRTSHRESR1
SCHEMBL28519714 0.70 USP7 (0.51) ABL1ABCB1BCRTSHRESR1
SCHEMBL9923796 0.70 TRPA1 (0.46) TSHRALDH1A1HPGDHSD17B10MAPT
Propane SCHEMBL28008506 0.70 BCL2L1 (0.60) ABL1ABCB1BCRESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2008045882-A1 SOLUBLE POLYMERS WITH HIGH CONVERSION OF ACID FROM AROMATIC EPOXY RESINS AND DIACIDS AND CROSSLINKED COATINGS PREPARED THEREFROM DOW GLOBAL TECHNOLOGIES INC. (US) 2008-04-17 WO claimed
WO-2008045884-A1 PROCESS FOR PREPARING SOLUBLE POLYMERS WITH HIGH CONVERSION OF ACID FROM AROMATIC EPOXY RESINS AND DIACIDS AND PROCESS FOR PREPARING CROSSLINKED COATINGS THEREFROM DOW GLOBAL TECHNOLOGIES INC. (US) 2008-04-17 WO claimed
WO-2008045889-A1 PROCESS FOR PREPARING SOLUBLE POLYMERS WITH LOW CONVERSION OF ACID FROM AROMATIC EPOXY RESINS AND DIACIDS AND PROCESS FOR PREPARING CROSSLINKED COATINGS THEREFROM DOW GLOBAL TECHNOLOGIES INC. (US) 2008-04-17 WO claimed
WO-2008045894-A1 SOLUBLE POLYMERS WITH LOW CONVERSION OF ACIDS FROM AROMATIC EPOXY RESINS AND DIACIDS AND CROSSLINKED COATINGS PREPARED THEREFROM DOW GLOBAL TECHNOLOGIES INC. (US) 2008-04-17 WO claimed
US-6555628-B2 Controlled conversion resins derived from reacting epoxy resin, dihydric phenol, acid anhydride, and/or amine; protective/powder coatings DOW GLOBAL TECHNOLOGIES INC. 2003-04-29 US claimed
US-20020128428-A1 Epoxy resins and process for making the same DOW DEUTSCHLAND INC. (DE) 2002-09-12 US claimed
WO-2002059177-A2 POLY (HYDROXYAMINOETHERS) HAVING A LOW CHLORIDE CONTENT DOW GLOBAL TECHNOLOGIES INC. (US) 2002-08-01 WO claimed
WO-2002048234-A2 EPOXY RESINS AND PROCESS FOR MAKING THE SAME DOW GLOBAL TECHNOLOGIES INC. (US) 2002-06-20 WO claimed
CN-108219366-B Thermally conductive three-dimensional (3-D) graphene-polymer composite material, preparation method and application thereof 沙特基础工业全球技术公司 2022-04-15 CN disclosed
EP-3555193-B1 THERMALLY CONDUCTIVE THREE-DIMENSIONAL (3-D) GRAPHENEPOLYMER COMPOSITE MATERIALS, METHODS OF MAKING, AND USES THEREOF SABIC GLOBAL TECHNOLOGIES BV (NL) 2022-01-19 EP disclosed
US-20200071487-A1 THERMALLY CONDUCTIVE THREE-DIMENSIONAL (3-D) GRAPHENE POLYMER COMPOSITE MATERIALS, METHODS OF MAKING, AND USES THEREOF SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2020-03-05 US disclosed
EP-3555193-A1 THERMALLY CONDUCTIVE THREE-DIMENSIONAL (3-D) GRAPHENEPOLYMER COMPOSITE MATERIALS, METHODS OF MAKING, AND USES THEREOF SABIC Global Technologies B.V. (NL) 2019-10-23 EP disclosed
WO-2018109618-A1 THERMALLY CONDUCTIVE THREE-DIMENSIONAL (3-D) GRAPHENEPOLYMER COMPOSITE MATERIALS, METHODS OF MAKING, AND USES THEREOF SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2018-06-21 WO disclosed
WO-2008045884-A1 PROCESS FOR PREPARING SOLUBLE POLYMERS WITH HIGH CONVERSION OF ACID FROM AROMATIC EPOXY RESINS AND DIACIDS AND PROCESS FOR PREPARING CROSSLINKED COATINGS THEREFROM DOW GLOBAL TECHNOLOGIES INC. (US) 2008-04-17 WO disclosed
WO-2002059177-A2 POLY (HYDROXYAMINOETHERS) HAVING A LOW CHLORIDE CONTENT DOW GLOBAL TECHNOLOGIES INC. (US) 2002-08-01 WO disclosed
WO-2002048234-A2 EPOXY RESINS AND PROCESS FOR MAKING THE SAME DOW GLOBAL TECHNOLOGIES INC. (US) 2002-06-20 WO disclosed
US-6051294-A RETORT-STERILIZABLE PACKAGING MATERIALS EXHIBITING HIGH BARRIER TO OXYGEN THE DOW CHEMICAL COMPANY (US) 2000-04-18 US disclosed
US-5814373-A PACKAGING OF OXYGEN SENSITIVE MATERIALS INSIDE A CONTAINER COMPRISING A THERMOPLASTIC POLYMER DOW CHEMICAL COMPANY (US) 1998-09-29 US disclosed
EP-0437348-A2 Epoxy modified polyols as dispersants for high styrene, high solids content polymer polyols ARCO Chemical Technology, L.P. (US) 1991-07-17 EP disclosed
EP-0024526-B1 EPOXY BASED SYNTHETIC SOLDER AMERICAN CYANAMID COMPANY (US) 1984-06-13 EP disclosed