SCHEMBL47863

SCHEMBL47863

Cc1ccc(Oc2ccc(C(C)(C)c3ccc(Oc4ccc(C)c(C)c4)cc3)cc2)cc1C

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.49
LMNA P02545 1/20 0.49
GFER P55789 1/20 0.49
L3MBTL1 Q9Y468 1/20 0.49
MAPT P10636 5/20 0.47
HPGD P15428 5/20 0.47
MEN1 O00255 3/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
NPC1 O15118 3/20 0.42
RAB9A P51151 3/20 0.42
ALDH1A1 P00352 2/20 0.42
MAPK1 P28482 1/20 0.42
HAO1 Q9UJM8 1/20 0.42
ESR1 P03372 2/20 0.41
TSHR P16473 3/20 0.40
TP53 P04637 2/20 0.40
CYP1A2 P05177 1/20 0.40
PPARG P37231 1/20 0.40
HIF1A Q16665 1/20 0.40
SLC6A4 P31645 6/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12792078 0.94 KMT2A (0.45) KMT2ALMNAGFERL3MBTL1MAPT
SCHEMBL16604045 0.93 KMT2A (0.44) KMT2ALMNAGFERL3MBTL1MAPT
SCHEMBL16604058 0.88 ALDH1A1 (0.54) KMT2ALMNAGFERL3MBTL1MAPT
SCHEMBL6440072 0.88 MAPT (0.57) KMT2ALMNAGFERL3MBTL1MAPT
SCHEMBL25615123 0.87 KMT2A (0.40) KMT2ALMNAGFERL3MBTL1MAPT
SCHEMBL13918884 0.87 KMT2A (0.40) KMT2ALMNAGFERL3MBTL1MAPT
SCHEMBL23717169 0.86 APP (0.48) KMT2ALMNAGFERL3MBTL1MAPT
SCHEMBL10993100 0.85 KMT2A (0.60) KMT2ALMNAGFERL3MBTL1MAPT
SCHEMBL47864 0.85 KMT2A (0.60) KMT2ALMNAGFERL3MBTL1MAPT
SCHEMBL10819670 0.85 KMT2A (0.50) KMT2ALMNAGFERL3MBTL1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 370 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240239988-A1 SEMICONDUCTOR ELEMENT ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEVICE HAVING CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-07-18 US disclosed
US-20240239988-A1 SEMICONDUCTOR ELEMENT ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEVICE HAVING CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-07-18 US disclosed
WO-2024141320-A1 RADIATION CURABLE LIQUID COMPOSITION, PROCESS OF FORMING 3D-PRINTED OBJECT AND 3D-PRINTED OBJECT BASF SE (DE) 2024-07-04 WO disclosed
US-20240018306-A1 RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR SYNTHESIZING POLYIMIDE PRECURSOR RESONAC CORPORATION (JP) 2024-01-18 US disclosed
US-20240018306-A1 RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR SYNTHESIZING POLYIMIDE PRECURSOR RESONAC CORPORATION (JP) 2024-01-18 US disclosed
US-20230399467-A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED SURFACE OF SUBSTRATE WITH SEMICONDUCTOR ELEMENT MOUNTED THEREON OR SEMICONDUCTOR ELEMENT-FORMING SURFACE OF WAFER WITH SEMICONDUCTOR ELEMENT FORMED THEREON, AND USE THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-14 US disclosed
US-20230399548-A1 BONDING FILM FOR HIGH-SPEED COMMUNICATION BOARD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-14 US disclosed
US-20230399548-A1 BONDING FILM FOR HIGH-SPEED COMMUNICATION BOARD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-14 US disclosed
US-20230399478-A1 CARBON FIBER COMPOSITE MATERIAL SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-14 US disclosed
US-20230399478-A1 CARBON FIBER COMPOSITE MATERIAL SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-14 US disclosed
US-20070161775-A1 Novel polyimide and method for preparing the same LG CHEM, LTD. (KR) 2007-07-12 US disclosed
US-20070141279-A1 ENVELOPE FOR IMAGE DISPLAY DEVICE, HERMETIC SEALING MATERIAL, SEALING METHOD AND IMAGE DISPLAY DEVICE ASAHI GLASS CO., LTD. (JP) 2007-06-21 US disclosed
US-20070141279-A1 ENVELOPE FOR IMAGE DISPLAY DEVICE, HERMETIC SEALING MATERIAL, SEALING METHOD AND IMAGE DISPLAY DEVICE ASAHI GLASS CO., LTD. (JP) 2007-06-21 US disclosed
WO-2007064160-A1 METHOD OF PRODUCING LIQUID CRYSTAL ALIGNING LAYER, LIQUID CRYSTAL ALIGNING LAYER PRODUCED USING THE SAME, AND LIQUID CRYSTAL DISPLAY INCLUDING LIQUID CRYSTAL ALIGNING LAYER LG CHEM. LTD. (KR) 2007-06-07 WO disclosed
US-20070128378-A1 Method of producing liquid crystal aligning layer, liquid crystal aligning layer produced using the same, and liquid crystal display including liquid crystal aligning layer LG CHEM, LTD. (KR) 2007-06-07 US disclosed
US-20070128378-A1 Method of producing liquid crystal aligning layer, liquid crystal aligning layer produced using the same, and liquid crystal display including liquid crystal aligning layer LG CHEM, LTD. (KR) 2007-06-07 US disclosed
WO-2007064156-A1 NOVEL POLYIMIDE AND METHOD FOR PREPARING THE SAME LG CHEM. LTD. (KR) 2007-06-07 WO disclosed
EP-1783806-A1 ENVELOPE FOR IMAGE DISPLAY, SEALING MATERIAL, SEALING METHOD, AND IMAGE DISPLAY Asahi Glass Company, Limited (JP) 2007-05-09 EP disclosed
US-7157548-B2 Crosslinked sulfonated polyimide films HANYANG HAK WON CO., LTD. (KR) 2007-01-02 US disclosed
US-7157548-B2 Crosslinked sulfonated polyimide films HANYANG HAK WON CO., LTD. (KR) 2007-01-02 US disclosed