SCHEMBL4787576

SCHEMBL4787576

CCC(OC)C1CC2C=CC1C2

nearest known ligand 0.34

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.34
ALDH1A1 P00352 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17120348 0.84 KDM4E (0.30) KDM4EALDH1A1
SCHEMBL13390388 0.80
SCHEMBL17121959 0.76 KDM4E (0.34) KDM4EALDH1A1
SCHEMBL32688720 0.75 EPHX2 (0.33) KDM4EALDH1A1
SCHEMBL4787655 0.75 KDM4E (0.30) KDM4EALDH1A1
SCHEMBL16949842 0.75 KDM4E (0.37) KDM4EALDH1A1
SCHEMBL200220 0.74 KDM4E (0.32) KDM4EALDH1A1
SCHEMBL16583778 0.74 ALDH1A1 (0.32) KDM4EALDH1A1
SCHEMBL16583816 0.74 KDM4E (0.30) KDM4EALDH1A1
SCHEMBL32689045 0.74 KDM4E (0.33) KDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080199805-A1 PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES FUJIFILM ELECTRONIC MATERIALS. U.S.A., INC. 2008-08-21 US disclosed
WO-2008098189-A1 PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-14 WO disclosed