SCHEMBL4787655

SCHEMBL4787655

COC(C)C1CC2C=CC1C2

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.30
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17121959 0.81 KDM4E (0.34) KDM4EALDH1A1
SCHEMBL6063918 0.79
SCHEMBL17120357 0.79 KDM4E (0.34) KDM4EALDH1A1
SCHEMBL6064246 0.79
SCHEMBL31345606 0.78 KDM4E (0.33) KDM4EALDH1A1
SCHEMBL1077813 0.78 KDM4E (0.33) KDM4EALDH1A1
SCHEMBL6422416 0.78 ALDH1A1 (0.33) KDM4EALDH1A1
SCHEMBL7684065 0.78 ALDH1A1 (0.35) KDM4EALDH1A1
SCHEMBL200230 0.75 ALDH1A1 (0.30) ALDH1A1
SCHEMBL4787576 0.75 KDM4E (0.34) KDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080199805-A1 PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES FUJIFILM ELECTRONIC MATERIALS. U.S.A., INC. 2008-08-21 US disclosed
WO-2008098189-A1 PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-14 WO disclosed