Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FFAR4 | Q5NUL3 | 2/20 | 0.65 |
| ▸ | FFAR1 | O14842 | 2/20 | 0.65 |
| ▸ | PPARD | Q03181 | 8/20 | 0.63 |
| ▸ | GPR84 | Q9NQS5 | 7/20 | 0.63 |
| ▸ | PPARG | P37231 | 7/20 | 0.63 |
| ▸ | PPARA | Q07869 | 7/20 | 0.63 |
| ▸ | HDAC11 | Q96DB2 | 5/20 | 0.63 |
| ▸ | TSHR | P16473 | 4/20 | 0.63 |
| ▸ | PTPN1 | P18031 | 3/20 | 0.63 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.63 |
| ▸ | TLR2 | O60603 | 2/20 | 0.63 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.63 |
| ▸ | FABP4 | P15090 | 2/20 | 0.63 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.63 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.63 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.63 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.63 |
| ▸ | SLC22A8 | Q8TCC7 | 1/20 | 0.63 |
| ▸ | MEN1 | O00255 | 1/20 | 0.63 |
| ▸ | ESR1 | P03372 | 1/20 | 0.63 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9159327 | 0.96 | FFAR4 (0.69) | FFAR4FFAR1PPARDGPR84PPARG | |
| SCHEMBL4464999 | 0.93 | ALDH1A1 (0.58) | FFAR4FFAR1PPARDGPR84PPARG | |
| SCHEMBL11579943 | 0.90 | FFAR4 (0.72) | FFAR4FFAR1PPARDGPR84PPARG | |
| SCHEMBL4806898 | 0.89 | FFAR4 (0.50) | FFAR4FFAR1PPARDGPR84PPARG | |
| SCHEMBL19032478 | 0.87 | FFAR4 (0.62) | FFAR4FFAR1PPARDGPR84PPARG | |
| SCHEMBL11404416 | 0.86 | FFAR4 (0.57) | FFAR4FFAR1PPARDGPR84PPARG | |
| SCHEMBL11129113 | 0.85 | FFAR4 (0.65) | FFAR4FFAR1PPARDGPR84PPARG | |
| SCHEMBL23829914 | 0.85 | FFAR4 (0.69) | FFAR4FFAR1PPARDGPR84PPARG | |
| SCHEMBL9860524 | 0.85 | FFAR4 (0.69) | FFAR4FFAR1PPARDGPR84PPARG | |
| SCHEMBL5915060 | 0.85 | FFAR4 (0.69) | FFAR4FFAR1PPARDGPR84PPARG |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107261148-A | Methylphenidate prodrug, its preparation and application | 凯姆制药公司 | 2017-10-20 | — | — | CN | claimed |
| CN-103826633-A | Methylphenidate prodrugs, methods of making and using the same | KEMPHARM INC | 2014-05-28 | — | — | CN | claimed |
| CN-108349049-A | Soldering paste water-soluble flux and soldering paste | 三菱综合材料株式会社 | 2018-07-31 | — | — | CN | disclosed |
| CN-107261148-A | Methylphenidate prodrug, its preparation and application | 凯姆制药公司 | 2017-10-20 | — | — | CN | disclosed |
| CN-103826633-B | Methylphenidate prodrugs, methods of making and using the same | 凯姆制药公司 | 2017-05-24 | — | — | CN | disclosed |
| CN-104349865-A | Solder paste | MITSUBISHI MATERIALS CORP | 2015-02-11 | — | — | CN | disclosed |
| CN-103826633-A | Methylphenidate prodrugs, methods of making and using the same | KEMPHARM INC | 2014-05-28 | — | — | CN | disclosed |
| US-7357291-B2 | Solder metal, soldering flux and solder paste | SHOWA DENKO K.K. (JP) | 2008-04-15 | — | — | US | disclosed |
| US-20060071051-A1 | Solder metal, soldering flux and solder paste | SHOWA DENKO K.K. (JP) | 2006-04-06 | — | — | US | disclosed |
| CN-1211183-C | Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method | SHOWA DENKO KK (JP) | 2005-07-20 | — | — | CN | disclosed |
| US-6881278-B2 | Flux for solder paste | SHOWA DENKO K.K. (JP) | 2005-04-19 | — | — | US | disclosed |
| US-20030200836-A1 | Flux for solder paste | SHOWA DENKO K.K. | 2003-10-30 | — | — | US | disclosed |
| WO-2003064102-A1 | SOLDER METAL, SOLDERING FLUX AND SOLDER PASTE | SHOWA DENKO K.K. (JP) | 2003-08-07 | — | — | WO | disclosed |
| CN-1358123-A | Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method | SHOWA DENKO KK (JP) | 2002-07-10 | — | — | CN | disclosed |
| US-20020046627-A1 | Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product | SHOWA DENKO K.K. (JP) | 2002-04-25 | — | — | US | disclosed |
| US-20010042779-A1 | Solder paste | SHOWA DENKO KABUSHIKI KAISHA (JP) | 2001-11-22 | — | — | US | disclosed |