Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FFAR4 | Q5NUL3 | 2/20 | 0.50 |
| ▸ | FFAR1 | O14842 | 2/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.49 |
| ▸ | GPR84 | Q9NQS5 | 7/20 | 0.47 |
| ▸ | PPARG | P37231 | 7/20 | 0.47 |
| ▸ | PPARD | Q03181 | 7/20 | 0.47 |
| ▸ | PPARA | Q07869 | 7/20 | 0.47 |
| ▸ | HDAC11 | Q96DB2 | 5/20 | 0.47 |
| ▸ | TSHR | P16473 | 5/20 | 0.47 |
| ▸ | PTPN1 | P18031 | 3/20 | 0.47 |
| ▸ | TLR2 | O60603 | 2/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.47 |
| ▸ | FABP4 | P15090 | 2/20 | 0.47 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.47 |
| ▸ | SLC22A8 | Q8TCC7 | 1/20 | 0.47 |
| ▸ | MEN1 | O00255 | 1/20 | 0.47 |
| ▸ | ESR1 | P03372 | 1/20 | 0.47 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.47 |
| ▸ | PDE4A | P27815 | 1/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4801632 | 0.89 | FFAR4 (0.65) | FFAR4FFAR1ALDH1A1GPR84PPARG | |
| SCHEMBL4464999 | 0.89 | ALDH1A1 (0.58) | FFAR4FFAR1ALDH1A1GPR84PPARG | |
| SCHEMBL9159327 | 0.85 | FFAR4 (0.69) | FFAR4FFAR1ALDH1A1GPR84PPARG | |
| SCHEMBL10937797 | 0.84 | ALDH1A1 (0.48) | FFAR4FFAR1ALDH1A1GPR84PPARD | |
| SCHEMBL4804388 | 0.81 | L3MBTL1 (0.48) | ALDH1A1PPARGPPARATSHRTDP1 | |
| SCHEMBL11579943 | 0.80 | FFAR4 (0.72) | FFAR4FFAR1ALDH1A1GPR84PPARG | |
| SCHEMBL11705517 | 0.79 | FFAR4 (0.55) | FFAR4FFAR1ALDH1A1GPR84PPARG | |
| SCHEMBL17866310 | 0.79 | FFAR4 (0.55) | FFAR4FFAR1ALDH1A1GPR84PPARG | |
| SCHEMBL10793503 | 0.79 | TSHR (0.50) | FFAR4FFAR1ALDH1A1GPR84PPARG | |
| SCHEMBL887688 | 0.77 | LMNA (0.53) | FFAR4FFAR1GPR84HDAC11TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-104349865-A | Solder paste | MITSUBISHI MATERIALS CORP | 2015-02-11 | — | — | CN | disclosed |
| CN-101307174-B | Surface-mounting electronic component | UENO FINE CHEMICAL IND | 2013-05-29 | — | — | CN | disclosed |
| CN-1899750-B | Solder metal, soldering flux and solder paste | SHOWA DENKO KK | 2010-06-16 | — | — | CN | disclosed |
| CN-101307174-A | Surface-mounting electronic component | UENO SEIYAKU KABUSHIKI KAISHA (JP) | 2008-11-19 | — | — | CN | disclosed |
| US-7357291-B2 | Solder metal, soldering flux and solder paste | SHOWA DENKO K.K. (JP) | 2008-04-15 | — | — | US | disclosed |
| CN-1298492-C | Solder metal, flux and solder paste | SHOWA DENKO KK (JP) | 2007-02-07 | — | — | CN | disclosed |
| CN-1899750-A | Solder metal, soldering flux and solder paste | SHOWA DENKO KK (JP) | 2007-01-24 | — | — | CN | disclosed |
| US-20060071051-A1 | Solder metal, soldering flux and solder paste | SHOWA DENKO K.K. (JP) | 2006-04-06 | — | — | US | disclosed |
| CN-1211183-C | Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method | SHOWA DENKO KK (JP) | 2005-07-20 | — | — | CN | disclosed |
| US-6881278-B2 | Flux for solder paste | SHOWA DENKO K.K. (JP) | 2005-04-19 | — | — | US | disclosed |
| CN-1578713-A | Solder metal, flux and solder paste | SHOWA DENKO KK (JP) | 2005-02-09 | — | — | CN | disclosed |
| US-20030200836-A1 | Flux for solder paste | SHOWA DENKO K.K. | 2003-10-30 | — | — | US | disclosed |
| WO-2003064102-A1 | SOLDER METAL, SOLDERING FLUX AND SOLDER PASTE | SHOWA DENKO K.K. (JP) | 2003-08-07 | — | — | WO | disclosed |
| CN-1358123-A | Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method | SHOWA DENKO KK (JP) | 2002-07-10 | — | — | CN | disclosed |
| US-20020046627-A1 | Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product | SHOWA DENKO K.K. (JP) | 2002-04-25 | — | — | US | disclosed |
| US-20010042779-A1 | Solder paste | SHOWA DENKO KABUSHIKI KAISHA (JP) | 2001-11-22 | — | — | US | disclosed |