Propylene Oxide

Propylene Oxide

SCHEMBL4803587

CC1CO1.CCCCOC1CO1

nearest known ligand 0.45

Full drug profile on Sugi Atlas →

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.45
ALDH1A1 P00352 4/20 0.38
TDP1 Q9NUW8 1/20 0.38
PPP5C P53041 1/20 0.36
GBA1 P04062 2/20 0.32
ADRB2 P07550 1/20 0.32
ADRB1 P08588 1/20 0.32
ADRB3 P13945 1/20 0.32
EBP Q15125 1/20 0.31
SIGMAR1 Q99720 1/20 0.31
HPGD P15428 1/20 0.30
PTAFR P25105 1/20 0.30
SPHK1 Q9NYA1 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4915956 0.93
SCHEMBL94047 0.86
SCHEMBL8751470 0.84 ALDH1A1 (0.53) SMN1; SMN2ALDH1A1TDP1GBA1HPGD
SCHEMBL1813583 0.84 ALDH1A1 (0.53) SMN1; SMN2ALDH1A1TDP1GBA1HPGD
SCHEMBL8751473 0.84 ALDH1A1 (0.53) SMN1; SMN2ALDH1A1TDP1GBA1HPGD
SCHEMBL2321510 0.84 ALDH1A1 (0.53) SMN1; SMN2ALDH1A1TDP1GBA1HPGD
SCHEMBL1187046 0.84 ALDH1A1 (0.53) SMN1; SMN2ALDH1A1TDP1GBA1HPGD
SCHEMBL1706788 0.84 ALDH1A1 (0.53) SMN1; SMN2ALDH1A1TDP1GBA1HPGD
SCHEMBL1900729 0.84 ALDH1A1 (0.53) SMN1; SMN2ALDH1A1TDP1GBA1HPGD
SCHEMBL8751484 0.84 ALDH1A1 (0.53) SMN1; SMN2ALDH1A1TDP1GBA1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112795960-A Chip copper interconnection electroplating additive, preparation method and application thereof 上海新阳半导体材料股份有限公司 2021-05-14 CN disclosed
CN-112760683-A Chip copper interconnection electroplating additive, preparation method and application thereof 上海新阳半导体材料股份有限公司 2021-05-07 CN disclosed
CN-112746292-A Chip copper interconnection electroplating additive, preparation method and application thereof 上海新阳半导体材料股份有限公司 2021-05-04 CN disclosed
CN-112725850-A Chip copper interconnection electroplating additive, preparation method and application thereof 上海新阳半导体材料股份有限公司 2021-04-30 CN disclosed
CN-112725851-A Chip copper interconnection electroplating additive, preparation method and application thereof 上海新阳半导体材料股份有限公司 2021-04-30 CN disclosed
EP-1749044-B2 FUNCTIONAL FLUIDS CONTAINING ALKYLENE OXIDE COPOLYMERS HAVING LOW PULMONARY TOXICITY BASF SE (DE) 2021-01-20 EP disclosed
US-7456138-B2 Functional fluids containing alkylene oxide copolymers having low pulmonary toxicity BASF AKTIENGESELLSCHAFT (DE) 2008-11-25 US disclosed
EP-1749044-B1 FUNCTIONAL FLUIDS CONTAINING ALKYLENE OXIDE COPOLYMERS HAVING LOW PULMONARY TOXICITY BASF AG (DE) 2007-09-26 EP disclosed
EP-1749044-A1 FUNCTIONAL FLUIDS CONTAINING ALKYLENE OXIDE COPOLYMERS HAVING LOW PULMONARY TOXICITY BASF AKTIENGESELLSCHAFT (DE) 2007-02-07 EP disclosed
WO-2005113640-A1 FUNCTIONAL FLUIDS CONTAINING ALKYLENE OXIDE COPOLYMERS HAVING LOW PULMONARY TOXICITY BASF AKTIENGESELLSCHAFT (DE) 2005-12-01 WO disclosed
US-20050256014-A1 Functional fluids containing alkylene oxide copolymers having low pulmonary toxicity BASF AKTIENGESELLSCHAFT (DE) 2005-11-17 US disclosed
WO-2005097899-A1 POLYALKYLENE GLYCOLS HAVING LOW INHALATION TOXICITY THE LUBRIZOL CORPORATION (US) 2005-10-20 WO disclosed
US-20020095021-A1 Water-soluble polyalkylene glycol oils having a high viscosity index and low aerosol toxicity CLARIANT GMBH (DE) 2002-07-18 US disclosed
US-20010031855-A1 Water-soluble polyalkylene glycol oils having a high viscosity index and low aerosol toxicity CLARIANT GMBH 2001-10-18 US disclosed