SCHEMBL4805780

SCHEMBL4805780

CCCCCCCCCCCCCCC=C(CCCC)c1cccc2ccccc12

nearest known ligand 0.45

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
CNR2 P34972 16/20 0.45
CNR1 P21554 10/20 0.45
CYP2C9 P11712 1/20 0.43
TBXAS1 P24557 2/20 0.41
SLC6A3 Q01959 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4805771 1.00 CNR2 (0.45) CNR2CNR1CYP2C9TBXAS1SLC6A3
SCHEMBL28736397 0.87 CNR2 (0.47) CNR2CNR1CYP2C9SLC6A3
SCHEMBL27930950 0.84 PTPN1 (0.44) CNR2CNR1CYP2C9SLC6A3
SCHEMBL27912828 0.79 CNR2 (0.43) CNR2CNR1CYP2C9SLC6A3
SCHEMBL26180950 0.78 CNR2 (0.49) CNR2CNR1CYP2C9TBXAS1SLC6A3
SCHEMBL27845163 0.75 CNR2 (0.46) CNR2CNR1CYP2C9SLC6A3
SCHEMBL28039330 0.75 CNR2 (0.51) CNR2CNR1CYP2C9SLC6A3
SCHEMBL6423825 0.75 CNR2 (0.51) CNR2CNR1CYP2C9SLC6A3
SCHEMBL28039091 0.75 CNR2 (0.51) CNR2CNR1CYP2C9SLC6A3
SCHEMBL2430993 0.74 TBXAS1 (0.41) CNR2CNR1TBXAS1SLC6A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1899750-B Solder metal, soldering flux and solder paste SHOWA DENKO KK 2010-06-16 CN claimed
US-7357291-B2 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2008-04-15 US claimed
CN-1899750-A Solder metal, soldering flux and solder paste SHOWA DENKO KK (JP) 2007-01-24 CN claimed
US-20060071051-A1 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2006-04-06 US claimed
CN-1578713-A Solder metal, flux and solder paste SHOWA DENKO KK (JP) 2005-02-09 CN claimed
WO-2003064102-A1 SOLDER METAL, SOLDERING FLUX AND SOLDER PASTE SHOWA DENKO K.K. (JP) 2003-08-07 WO claimed
CN-1899750-B Solder metal, soldering flux and solder paste SHOWA DENKO KK 2010-06-16 CN disclosed
US-7357291-B2 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2008-04-15 US disclosed
CN-1298492-C Solder metal, flux and solder paste SHOWA DENKO KK (JP) 2007-02-07 CN disclosed
CN-1899750-A Solder metal, soldering flux and solder paste SHOWA DENKO KK (JP) 2007-01-24 CN disclosed
US-20060071051-A1 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2006-04-06 US disclosed
CN-1578713-A Solder metal, flux and solder paste SHOWA DENKO KK (JP) 2005-02-09 CN disclosed
JP-2003225796-A SOLDERING FLUX SHOWA DENKO KK 2003-08-12 JP disclosed