SCHEMBL48080

SCHEMBL48080

COc1ccc(Cc2ccc(OC(=O)Oc3ccc(Cc4ccc(OC)cc4)cc3)cc2)cc1

nearest known ligand 0.61

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
SAE1 Q9UBE0 1/20 0.61
UBA2 Q9UBT2 1/20 0.61
LTA4H P09960 1/20 0.59
ELANE P08246 1/20 0.56
KMT2A Q03164 1/20 0.53
HTT P42858 1/20 0.52
LDHA P00338 1/20 0.52
SMN1; SMN2 Q16637 2/20 0.51
F2RL1 P55085 1/20 0.50
ATM Q13315 1/20 0.49
TDP1 Q9NUW8 1/20 0.49
L3MBTL1 Q9Y468 1/20 0.49
ALDH1A1 P00352 1/20 0.48
IDO1 P14902 1/20 0.47
CES2 O00748 1/20 0.47
CES1 P23141 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14408671 0.92 SAE1 (0.62) SAE1UBA2LTA4HELANEKMT2A
SCHEMBL1398350 0.87 CES2 (0.58) KMT2AHTTSMN1; SMN2ALDH1A1CES2
SCHEMBL684696 0.86 SAE1 (0.59) SAE1UBA2LTA4HELANEKMT2A
SCHEMBL16192951 0.85 MAOB (0.56) KMT2AHTTLDHASMN1; SMN2F2RL1
SCHEMBL14064745 0.83 ELANE (0.49) SAE1UBA2LTA4HELANEKMT2A
SCHEMBL18230885 0.83 SAE1 (0.46) SAE1UBA2LTA4HELANEKMT2A
SCHEMBL27884 0.82 LTA4H (0.81) SAE1UBA2LTA4HSMN1; SMN2ATM
SCHEMBL1425001 0.82 LTA4H (0.81) SAE1UBA2LTA4HSMN1; SMN2ATM
SCHEMBL14570712 0.82 ESR1 (0.58) ELANEKMT2A
SCHEMBL5478152 0.82 LTA4H (0.55) LTA4HELANEL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11655326-B2 Molded body containing polycarbonate-polyorganosiloxane copolymer IDEMITSU KOSAN CO., LTD. (JP) 2023-05-23 US disclosed
EP-2149586-B1 AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE MITSUBISHI GAS CHEMICAL CO (JP) 2018-01-03 EP disclosed
US-8128782-B2 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2012-03-06 US disclosed
US-20100160494-A1 AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE MITSUBISHI GAS CHEMICAL COMPANY INC. (JP) 2010-06-24 US disclosed
EP-2149586-A1 AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE Mitsubishi Gas Chemical Company, Inc. (JP) 2010-02-03 EP disclosed