SCHEMBL4813288

SCHEMBL4813288

CC(C)Cc1ccc2c3c(cccc13)CC2

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.49
KDM4E B2RXH2 9/20 0.47
ALDH1A1 P00352 9/20 0.47
HPGD P15428 6/20 0.47
GAA P10253 3/20 0.47
MEN1 O00255 2/20 0.47
KMT2A Q03164 2/20 0.47
MAPT P10636 2/20 0.47
SMN1; SMN2 Q16637 2/20 0.45
HSD17B10 Q99714 2/20 0.41
GABRA1 P14867 1/20 0.41
GABRB2 P47870 1/20 0.41
CYP3A4 P08684 2/20 0.41
ALOX15 P16050 1/20 0.41
POLB P06746 2/20 0.40
ATM Q13315 1/20 0.40
CYP11B1 P15538 1/20 0.37
CYP11B2 P19099 1/20 0.37
CYP1A2 P05177 1/20 0.37
CYP2D6 P10635 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5376065 0.79 ALDH1A1 (0.53) LMNAKDM4EALDH1A1HPGDGAA
SCHEMBL9891402 0.78 LMNA (0.46) LMNAKDM4EALDH1A1HPGDGAA
SCHEMBL13101720 0.77 ALDH1A1 (0.53) LMNAKDM4EALDH1A1HPGDGAA
SCHEMBL29093412 0.76 KDM4E (0.48) LMNAKDM4EALDH1A1HPGDGAA
SCHEMBL9891408 0.76 LMNA (0.43) LMNAKDM4EALDH1A1HPGDGAA
SCHEMBL28566555 0.76 ALDH1A1 (0.41) LMNAKDM4EALDH1A1HPGDGAA
SCHEMBL27749165 0.76 ALDH1A1 (0.52) LMNAKDM4EALDH1A1HPGDGAA
SCHEMBL5165673 0.76 KDM4E (0.57) LMNAKDM4EALDH1A1HPGDGAA
SCHEMBL18826311 0.75 KDM4E (0.47) LMNAKDM4EALDH1A1HPGDGAA
SCHEMBL1253705 0.75 ALDH1A1 (0.47) LMNAKDM4EALDH1A1HPGDGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7357291-B2 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2008-04-15 US disclosed
US-20060071051-A1 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2006-04-06 US disclosed
WO-2003064102-A1 SOLDER METAL, SOLDERING FLUX AND SOLDER PASTE SHOWA DENKO K.K. (JP) 2003-08-07 WO disclosed