SCHEMBL481766

SCHEMBL481766

C=CCO[Si](C=C)(OCC=C)OCC=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL647931 0.84
SCHEMBL74467 0.73
SCHEMBL6567220 0.71
SCHEMBL6567222 0.71
SCHEMBL11135037 0.71
SCHEMBL19795365 0.71 CA12 (0.32)
SCHEMBL3317961 0.71
SCHEMBL10420152 0.69
SCHEMBL818543 0.69 ALDH1A1 (0.32)
SCHEMBL180320 0.69 TSHR (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 156 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118398276-A Silver-coated copper slurry, and strong light curing process and application thereof 华中科技大学温州先进制造技术研究院 2024-07-26 CN claimed
CN-113035408-B Solar cell grid line slurry and preparation method thereof, and solar cell 深圳市百柔新材料技术有限公司 2024-02-02 CN claimed
CN-117018876-A Preparation method of graphene oxide reverse osmosis membrane and graphene oxide reverse osmosis membrane 中集安瑞科工程科技有限公司 2023-11-10 CN claimed
CN-113035408-A Solar cell grid line paste and preparation method thereof, and solar cell 深圳市百柔新材料技术有限公司 2021-06-25 CN claimed
WO-2011102957-A1 ADHESION REDUCTION BETWEEN A METAL CONDUCTOR AND AN INSULATION SHEATH DOW GLOBAL TECHNOLOGIES LLC (US) 2011-08-25 WO claimed
EP-1190866-B1 Photocrosslinkable latex protective overcoat for imaging elements EASTMAN KODAK CO (US) 2004-03-03 EP claimed
US-3966687-A TRIALKYLOXYVINYLSILANE MANUFACTURE DE PRODUITS CHIMIQUES PROTEX (FR) 1976-06-29 US claimed
US-12559656-B2 Solvent-free moisture curing silicone conformal coating and preparation method thereof CHENGDU TALY TECHNOLOGY CO., LTD. (CN) 2026-02-24 US disclosed
US-20250155846-A1 VOLUME HOLOGRAM LAMINATE, METHOD FOR PRODUCING VOLUME HOLOGRAM LAMINATE, VOLUME HOLOGRAM TRANSFER FOIL, VOLUME HOLOGRAM LABEL, VOLUME HOLOGRAM SHEET FOR EMBEDDING, CARD, AND HOLOGRAM STICKER-TYPE PRODUCT DAI NIPPON PRINTING CO., LTD. (JP) 2025-05-15 US disclosed
EP-4459379-A1 VOLUME HOLOGRAM LAMINATE, METHOD FOR PRODUCING VOLUME HOLOGRAM LAMINATE, VOLUME HOLOGRAM TRANSFER FOIL, VOLUME HOLOGRAM LABEL, VOLUME HOLOGRAM SHEET FOR EMBEDDING, CARD, AND HOLOGRAM STICKER-TYPE PRODUCT Dai Nippon Printing Co., Ltd. (JP) 2024-11-06 EP disclosed
CN-118725482-A Anti-aging insulated cable material and preparation method thereof 富通光纤光缆(深圳)有限公司 2024-10-01 CN disclosed
CN-118398276-A Silver-coated copper slurry, and strong light curing process and application thereof 华中科技大学温州先进制造技术研究院 2024-07-26 CN disclosed
US-20240059944-A1 SOLVENT-FREE MOISTURE CURING SILICONE CONFORMAL COATING AND PREPARATION METHOD THEREOF CHENGDU TALY TECHNOLOGY CO., LTD. (CN) 2024-02-22 US disclosed
EP-0220593-A1 Copolymer, process for its preparation and its use in the bonding of enzymes HOECHST AKTIENGESELLSCHAFT (DE) 1987-05-06 EP disclosed
US-4576973-A ADSORBENT BEAD CASSELLA AKTIENGESELLSCHAFT (DE) 1986-03-18 US disclosed
US-4552905-A VINYL-SUBSTITUTED PYRIDINE, QUINOLINE, ISO-QUINOLINE, OR PYRAZINE;N-VINYLAMIDE, CROSSLINKER CASSELLA AKTIENGESELLSCHAFT (DE) 1985-11-12 US disclosed
EP-0134921-A1 Copolymer, process for its preparation and its use as a sorbent CASSELLA Aktiengesellschaft (DE) 1985-03-27 EP disclosed
EP-0131179-A1 Copolymer, process for its preparation and its use as a sorbent CASSELLA Aktiengesellschaft (DE) 1985-01-16 EP disclosed
US-3966687-A TRIALKYLOXYVINYLSILANE MANUFACTURE DE PRODUITS CHIMIQUES PROTEX (FR) 1976-06-29 US disclosed
US-3966687-A TRIALKYLOXYVINYLSILANE MANUFACTURE DE PRODUITS CHIMIQUES PROTEX (FR) 1976-06-29 US disclosed