SCHEMBL4822090

SCHEMBL4822090

O=C(O)C1=CC2C(=O)OC(=O)C2CC1

nearest known ligand 0.47

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
OAT P04181 1/20 0.40
CES2 O00748 3/20 0.33
CNR1 P21554 1/20 0.33
CNR2 P34972 1/20 0.33
LMNA P02545 1/20 0.33
TSHR P16473 1/20 0.33
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31
SRD5A2 P31213 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL216911 0.73 TAS2R46 (0.39) CNR1MEN1KMT2A
SCHEMBL7190170 0.73
SCHEMBL7188891 0.73 TAS2R46 (0.39) CNR1MEN1KMT2A
SCHEMBL7190172 0.73
SCHEMBL7190177 0.73
SCHEMBL9450413 0.73
SCHEMBL9450292 0.73
SCHEMBL7173427 0.73 TAS2R46 (0.39) CNR1MEN1KMT2A
SCHEMBL7188829 0.71 KMT2A (0.33) TSHRKMT2A
SCHEMBL7188835 0.71 KMT2A (0.33) TSHRKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20150051315-A1 Mixture of Benzoxazine, Epoxy and Anhydride HUNTSMAN ADVANCED MATERIALS AMERICAS LLC 2015-02-19 US claimed
EP-2814802-A1 MIXTURE OF BENZOXAZINE, EPOXY AND ANHYDRIDE Huntsman Advanced Materials Americas LLC (US) 2014-12-24 EP claimed
WO-2013122800-A1 MIXTURE OF BENZOXAZINE, EPOXY AND ANHYDRIDE HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) 2013-08-22 WO claimed
US-7374862-B2 Photosensitive resin composition and curing product thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2008-05-20 US claimed
US-20060102051-A1 Photosensitive resin composition and curing product thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2006-05-18 US claimed
CN-116893574-A Substrate with cured film, photosensitive resin composition, method for producing substrate with cured film, and display device 日铁化学材料株式会社 2023-10-17 CN disclosed
CN-112689656-B Method for preparing polyamideimide film and polyamideimide film prepared therefrom 聚酰亚胺先端材料有限公司 2023-02-21 CN disclosed
CN-106681104-B Photosensitive resin composition and method for producing same, light shielding film and method for producing same, and liquid crystal display device and method for producing same 日铁化学材料株式会社 2021-06-15 CN disclosed
CN-112689656-A Method for producing polyamideimide film and polyamideimide film produced thereby 聚酰亚胺先端材料有限公司 2021-04-20 CN disclosed
WO-2020071588-A1 METHOD FOR PRODUCING POLYAMIDEIMIDE FILM, AND POLYAMIDEIMIDE FILM PRODUCED THEREFROM 에스케이씨코오롱피아이 주식회사 2020-04-09 WO disclosed
US-20170008994-A1 Reaction Hybrid Benzoxazine Resins and Uses Thereof HUNTSMAN ADVANCED MATERIALS AMERICAS LLC 2017-01-12 US disclosed
EP-3110864-A1 REACTION HYBRID BENZOXAZINE RESINS AND USES THEREOF Huntsman Advanced Materials Americas LLC (US) 2017-01-04 EP disclosed
WO-2015130464-A1 REACTION HYBRID BENZOXAZINE RESINS AND USES THEREOF HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) 2015-09-03 WO disclosed
US-20150175794-A1 ALKALI-SOLUBLE RESIN COMPONENT AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME CHI MEI CORPORATION (TW) 2015-06-25 US disclosed
US-20150051315-A1 Mixture of Benzoxazine, Epoxy and Anhydride HUNTSMAN ADVANCED MATERIALS AMERICAS LLC 2015-02-19 US disclosed
EP-2814802-A1 MIXTURE OF BENZOXAZINE, EPOXY AND ANHYDRIDE Huntsman Advanced Materials Americas LLC (US) 2014-12-24 EP disclosed
WO-2013122800-A1 MIXTURE OF BENZOXAZINE, EPOXY AND ANHYDRIDE HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) 2013-08-22 WO disclosed
US-7374862-B2 Photosensitive resin composition and curing product thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2008-05-20 US disclosed
US-20060102051-A1 Photosensitive resin composition and curing product thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2006-05-18 US disclosed
EP-1600812-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURING PRODUCT THEREOF Nippon Kayaku Kabushiki Kaisha (JP) 2005-11-30 EP disclosed