SCHEMBL482677

SCHEMBL482677

CCN(c1ccc(F)c([Ti](C2=CC=CC2)(C2=CC=CC2)c2c(F)ccc(N(CC)[Si](C)(C)C(C)(C)C(C)C)c2F)c1F)[Si](C)(C)C(C)(C)C(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23854462 0.77
SCHEMBL9314714 0.75
SCHEMBL599903 0.74 MLYCD (0.34)
SCHEMBL9865579 0.74
SCHEMBL482987 0.73
SCHEMBL483057 0.72 RIPK1 (0.37)
SCHEMBL483092 0.72 RIPK1 (0.31)
SCHEMBL29104889 0.72 ALOX5AP (0.30)
SCHEMBL483156 0.72 ADORA2A (0.32)
SCHEMBL482861 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113168093-B Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2024-04-30 CN disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
CN-113383273-A Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2021-09-10 CN disclosed
CN-113168093-A Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2021-07-23 CN disclosed
US-20210197447-A1 Method for Making an Object PHOTOCENTRIC LIMITED (GB) 2021-07-01 US disclosed
EP-3295246-B1 METHOD FOR MAKING AN OBJECT PHOTOCENTRIC LTD (GB) 2019-05-01 EP disclosed
US-20180141268-A1 Method for Making an Object PHOTOCENTRIC LIMITED (GB) 2018-05-24 US disclosed
EP-1471387-B1 Photosensitive composition and compound used thereof FUJIFILM CORP (JP) 2015-11-11 EP disclosed
EP-1249731-B1 Photosensitive composition and negative working lithographic printing plate FUJIFILM CORP (JP) 2012-04-25 EP disclosed
US-8114569-B2 Maskless photopolymer exposure process and apparatus PHOTOCENTRIC LIMITED (GB) 2012-02-14 US disclosed
EP-1341040-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 2003-09-03 EP disclosed
US-20030091933-A1 Photosensitive composition and negative working lithographic printing plate FUJIFILM CORPORATION (JP) 2003-05-15 US disclosed
US-20030084806-A1 FINE PARTICLES CONTAINING A RADICAL POLYMERIZABLE ENCAPSULATED BY MICROCAPSULES FUJIFILM CORPORATION (JP) 2003-05-08 US disclosed
EP-1288720-A1 Plate-making method of printing plate FUJI PHOTO FILM CO., LTD. (JP) 2003-03-05 EP disclosed
EP-1249731-A2 Photosensitive composition and negative working lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2002-10-16 EP disclosed
EP-1238801-A2 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2002-09-11 EP disclosed
EP-0860741-B1 Photopolymerizable composition FUJI PHOTO FILM CO LTD (JP) 2001-05-16 EP disclosed
US-6051367-A COMPRISING ONE OR MORE ADDITION-POLYMERIZABLE ETHYLENICALLY UNSATURATED COMPOUNDS AND A SPECIFIC OXIME ETHER COMPOUND; HIGH SENSITIVE TO ACTINIC RAYS RANGING FROM ULTRAVIOLET TO VISIBLE LIGHT, IMPROVED FILM STRENGTH FUJI PHOTO FILM CO., LTD. (JP) 2000-04-18 US disclosed
EP-0860741-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1998-08-26 EP disclosed
US-5026625-A Photoinitiators for polymerization of ethylenically unsaturated compounds CIBA-GEIGY CORPORATION (US) 1991-06-25 US disclosed