Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APLNR | P35414 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL729545 | 0.78 | — | — | |
| SCHEMBL729544 | 0.78 | — | — | |
| SCHEMBL28620792 | 0.77 | CNR2 (0.31) | — | |
| SCHEMBL11184976 | 0.77 | — | — | |
| SCHEMBL4247302 | 0.77 | CNR2 (0.31) | — | |
| SCHEMBL3478144 | 0.76 | — | — | |
| SCHEMBL5840808 | 0.76 | — | — | |
| SCHEMBL11171657 | 0.74 | CYP3A4 (0.38) | — | |
| SCHEMBL15067322 | 0.71 | FGF23 (0.43) | — | |
| SCHEMBL15067321 | 0.71 | FGF23 (0.43) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 315 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110446739-B | Fluoroacetophenone-containing derivative, fluorine-containing additive, curable composition containing the same, and cured product thereof | DIC株式会社 | 2022-01-11 | — | — | CN | disclosed |
| US-10961405-B2 | Fluorine-containing acetophenone derivative, fluroine based additive, curable composition including same, and cured product thereof | DIC CORPORATION (JP) | 2021-03-30 | — | — | US | disclosed |
| CN-111954849-A | Photosensitive resin composition, cured product, insulating material, resin material for solder resist, and resist member | DIC株式会社 | 2020-11-17 | — | — | CN | disclosed |
| WO-2019198489-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESISTS AND RESIST MEMBER | DIC株式会社 | 2019-10-17 | — | — | WO | disclosed |
| EP-1657286-B1 | Radiation curable ink jet ink, comprising a polymerisation initiation sensitising dye | FUJIFILM CORP (JP) | 2018-07-04 | — | — | EP | disclosed |
| US-9957402-B2 | Compound, active energy ray curable composition, cured article thereof, printing ink, and inkjet recording ink | DIC CORPORATION (JP) | 2018-05-01 | — | — | US | disclosed |
| EP-1859954-B2 | Planographic printing plate precursor and stack thereof | FUJIFILM CORP (JP) | 2017-11-08 | — | — | EP | disclosed |
| EP-2042921-B1 | Pigment dispersion composition, photocurable composition and color filter | FUJIFILM CORP (JP) | 2017-10-25 | — | — | EP | disclosed |
| EP-2006738-B1 | Lithographic printing plate precursor | FUJIFILM CORP (JP) | 2017-09-06 | — | — | EP | disclosed |
| EP-1975707-B1 | Curable composition and planographic printing plate precursor | FUJIFILM CORP (JP) | 2017-07-19 | — | — | EP | disclosed |
| US-6153660-A | VERY HIGH SENSITIVITY TO BEAMS IN THE VISIBLE REGION, PARTICULARLY TO VISIBLE RAYS AT 400 NM OR MORE SUCH AS RAYS AT 488 NM OR 532 NM CORRESPONDING TO THE OUTPUT OF AR+ LASER OR YAG-SHG LASER | FUJI PHOTO FILM CO., LTD. (JP) | 2000-11-28 | — | — | US | disclosed |
| EP-1048981-A1 | Negative type image recording material | FUJI PHOTO FILM CO., LTD. (JP) | 2000-11-02 | — | — | EP | disclosed |
| EP-1038668-A2 | Photosensitive composition and planographic printing plate precursor using same | FUJI PHOTO FILM CO., LTD. (JP) | 2000-09-27 | — | — | EP | disclosed |
| EP-1035435-A2 | Photosensitive composition and 1,3-dihydro-1-oxo-2H-indene derivative | FUJI PHOTO FILM CO., LTD. (JP) | 2000-09-13 | — | — | EP | disclosed |
| EP-1031414-A1 | Lithographic printing plate precursor | FUJI PHOTO FILM CO., LTD. (JP) | 2000-08-30 | — | — | EP | disclosed |
| US-6051367-A | COMPRISING ONE OR MORE ADDITION-POLYMERIZABLE ETHYLENICALLY UNSATURATED COMPOUNDS AND A SPECIFIC OXIME ETHER COMPOUND; HIGH SENSITIVE TO ACTINIC RAYS RANGING FROM ULTRAVIOLET TO VISIBLE LIGHT, IMPROVED FILM STRENGTH | FUJI PHOTO FILM CO., LTD. (JP) | 2000-04-18 | — | — | US | disclosed |
| EP-0980754-A1 | Method of making lithographic printing plate and photopolymer composition | FUJI PHOTO FILM CO., LTD. (JP) | 2000-02-23 | — | — | EP | disclosed |
| EP-0949540-A1 | Method for producing lithographic printing plate suitable for laser scan exposure, and photopolymerizable composition | FUJI PHOTO FILM CO., LTD (JP) | 1999-10-13 | — | — | EP | disclosed |
| EP-0924570-A1 | Photopolymerizable composition | FUJI PHOTO FILM CO., LTD. (JP) | 1999-06-23 | — | — | EP | disclosed |
| EP-0860741-A1 | Photopolymerizable composition | FUJI PHOTO FILM CO., LTD. (JP) | 1998-08-26 | — | — | EP | disclosed |