Di(Hydroxyethyl)Ether

Di(Hydroxyethyl)Ether

SCHEMBL4830573

CCOC(C)C.OCCOCCO

nearest known ligand 0.55

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Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.55
TSHR P16473 2/20 0.50
MAPK1 P28482 1/20 0.50
MEN1 O00255 2/20 0.48
KMT2A Q03164 2/20 0.48
THRB P10828 2/20 0.43
HTT P42858 1/20 0.43
MAPT P10636 1/20 0.43
LMNA P02545 1/20 0.39
HSD17B10 Q99714 1/20 0.31
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Di(Hydroxyethyl)Ether SCHEMBL10711395 0.85 LMNA (0.60) ALDH1A1TSHRMAPK1MEN1KMT2A
Ethylene Glycol SCHEMBL11566968 0.84 LMNA (0.47) ALDH1A1TSHRTHRBLMNATDP1
Di(Hydroxyethyl)Ether SCHEMBL4840428 0.83 TSHR (0.52) ALDH1A1TSHRMAPK1MEN1KMT2A
SCHEMBL9640229 0.82 MEN1 (0.58) ALDH1A1TSHRMAPK1MEN1KMT2A
SCHEMBL157251 0.82 MEN1 (0.58) ALDH1A1TSHRMAPK1MEN1KMT2A
SCHEMBL3876514 0.82 MEN1 (0.58) ALDH1A1TSHRMAPK1MEN1KMT2A
SCHEMBL9639782 0.82 MEN1 (0.58) ALDH1A1TSHRMAPK1MEN1KMT2A
SCHEMBL9640265 0.82 MEN1 (0.58) ALDH1A1TSHRMAPK1MEN1KMT2A
SCHEMBL9639247 0.82 MEN1 (0.58) ALDH1A1TSHRMAPK1MEN1KMT2A
SCHEMBL9640528 0.82 MEN1 (0.58) ALDH1A1TSHRMAPK1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-10139633-A None JP disclosed
WO-2025028519-A1 BLOCKED ISOCYANATE COMPOSITION, COATING MATERIAL COMPOSITION, AND COATING FILM 旭化成株式会社 2025-02-06 WO disclosed
US-20240287243-A1 BLOCKED POLYISOCYANATE COMPOSITION, RESIN COMPOSITION, RESIN FILM AND LAMINATE ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-08-29 US disclosed
EP-4364944-A1 BLOCK POLYISOCYANATE COMPOSITION, RESIN COMPOSITION, RESIN FILM, AND LAYERED BODY Asahi Kasei Kabushiki Kaisha (JP) 2024-05-08 EP disclosed
EP-3771720-B1 BLOCKED POLYISOCYANATE COMPOSITION, RESIN COMPOSITION, RESIN FILM AND LAMINATE ASAHI CHEMICAL IND (JP) 2024-05-01 EP disclosed
CN-116082936-B Blocked polyisocyanate composition and method for producing same, resin composition, resin film and method for producing same, and laminate 旭化成株式会社 2024-04-05 CN disclosed
EP-3689936-B1 BLOCKED POLYISOCYANATE COMPOSITION AND USE THEREOF ASAHI CHEMICAL IND (JP) 2024-03-06 EP disclosed
CN-117580887-A Blocked polyisocyanate composition, resin film, and laminate 旭化成株式会社 2024-02-20 CN disclosed
EP-4321585-A2 BLOCKED POLYISOCYANATE COMPOSITION AND METHOD FOR PRODUCING THE SAME, RESIN COMPOSITION, RESIN FILM AND METHOD FOR PRODUCING THE SAME, AND LAMINATE Asahi Kasei Kabushiki Kaisha (JP) 2024-02-14 EP disclosed
CN-113939552-B Blocked polyisocyanate composition, one-component coating composition, coating film and coated article 旭化成株式会社 2024-01-30 CN disclosed
CN-103946747-A Negative-type photosensitive resin composition, partition wall, black matrix, and optical element ASAHI GLASS CO LTD 2014-07-23 CN disclosed
CN-102898149-A Solvent or solvent composition for manufacturing laminated ceramic member DAICEL CHEM 2013-01-30 CN disclosed
CN-102731112-A Solvent or solvent composition for producing laminated ceramic component DAICEL FINECHEM LTD 2012-10-17 CN disclosed
US-7338737-B2 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-03-04 US disclosed
US-7297452-B2 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-11-20 US disclosed
US-20070254221-A1 Akali-soluble resin, quinone diazide, surfactant mixture of a 3-perfluoroalkylpropane epoxide and polyethersilicones), and a solvent; high-quality display panels with uniformly-coated insulating layers. SAMSUNG DISPLAY CO., LTD. (KR) 2007-11-01 US disclosed
US-20060141393-A1 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. 2006-06-29 US disclosed
US-20060131267-A1 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG DISPLAY CO., LTD. (KR) 2006-06-22 US disclosed
JP-H10139633-A HAIR COSMETIC KAO CORP 1998-05-26 JP disclosed
US-4176132-A Reaction of organic diisocyanates with water ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1979-11-27 US disclosed