SCHEMBL483167

SCHEMBL483167

CCCCCCN(C(=O)C(C)(CC)CC)c1ccc(F)c([Ti](C2=CC=CC2)(C2=CC=CC2)c2c(F)ccc(N(CCCCCC)C(=O)C(C)(CC)CC)c2F)c1F

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
PPARG P37231 1/20 0.32
PPARA Q07869 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL482671 0.93 RIPK1 (0.34) PPARGPPARA
SCHEMBL482515 0.91 PPARG (0.31) PPARGPPARA
SCHEMBL483088 0.89
SCHEMBL482924 0.89 RIPK1 (0.35)
SCHEMBL268503 0.88
SCHEMBL483195 0.87 RIPK1 (0.31)
SCHEMBL482977 0.85
SCHEMBL482952 0.84 NPC1 (0.35)
SCHEMBL599447 0.83 S1PR1 (0.33)
SCHEMBL482967 0.83 S1PR1 (0.40)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12078929-B2 Photosensitive resin composition, pattern forming method, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2024-09-03 US disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 CN disclosed
US-20210302835-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
US-20210302836-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
CN-113383273-A Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2021-09-10 CN disclosed
CN-113168093-A Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2021-07-23 CN disclosed
US-20210197447-A1 Method for Making an Object PHOTOCENTRIC LIMITED (GB) 2021-07-01 US disclosed
EP-3295246-B1 METHOD FOR MAKING AN OBJECT PHOTOCENTRIC LTD (GB) 2019-05-01 EP disclosed
US-20180141268-A1 Method for Making an Object PHOTOCENTRIC LIMITED (GB) 2018-05-24 US disclosed
EP-1471387-B1 Photosensitive composition and compound used thereof FUJIFILM CORP (JP) 2015-11-11 EP disclosed
EP-1341040-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 2003-09-03 EP disclosed
US-20030091933-A1 Photosensitive composition and negative working lithographic printing plate FUJIFILM CORPORATION (JP) 2003-05-15 US disclosed
US-20030084806-A1 FINE PARTICLES CONTAINING A RADICAL POLYMERIZABLE ENCAPSULATED BY MICROCAPSULES FUJIFILM CORPORATION (JP) 2003-05-08 US disclosed
EP-1288720-A1 Plate-making method of printing plate FUJI PHOTO FILM CO., LTD. (JP) 2003-03-05 EP disclosed
EP-1249731-A2 Photosensitive composition and negative working lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2002-10-16 EP disclosed
EP-1238801-A2 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2002-09-11 EP disclosed
EP-0860741-B1 Photopolymerizable composition FUJI PHOTO FILM CO LTD (JP) 2001-05-16 EP disclosed
US-6051367-A COMPRISING ONE OR MORE ADDITION-POLYMERIZABLE ETHYLENICALLY UNSATURATED COMPOUNDS AND A SPECIFIC OXIME ETHER COMPOUND; HIGH SENSITIVE TO ACTINIC RAYS RANGING FROM ULTRAVIOLET TO VISIBLE LIGHT, IMPROVED FILM STRENGTH FUJI PHOTO FILM CO., LTD. (JP) 2000-04-18 US disclosed
EP-0860741-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1998-08-26 EP disclosed
US-5026625-A Photoinitiators for polymerization of ethylenically unsaturated compounds CIBA-GEIGY CORPORATION (US) 1991-06-25 US disclosed