⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL474754 | 0.85 | ALDH1A1 (0.33) | — | |
| SCHEMBL17123455 | 0.76 | — | — | |
| SCHEMBL190883 | 0.69 | — | — | |
| SCHEMBL26676530 | 0.69 | — | — | |
| SCHEMBL433792 | 0.67 | TSHR (0.31) | — | |
| SCHEMBL273377 | 0.65 | ALDH1A1 (0.36) | — | |
| SCHEMBL24799608 | 0.64 | — | — | |
| SCHEMBL26798619 | 0.64 | — | — | |
| SCHEMBL5583492 | 0.64 | — | — | |
| SCHEMBL16588443 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114016001-A | Compositions for depositing silicon-containing films and methods of using the same | 弗萨姆材料美国有限责任公司 | 2022-02-08 | — | — | CN | claimed |
| US-20190292658-A1 | COMPOSITIONS AND METHODS USING SAME FOR DEPOSITION OF SILICON-CONTAINING FILM | VERSUM MATERIALS US, LLC | 2019-09-26 | — | — | US | claimed |
| US-20020142585-A1 | Very low dielectric constant plasma-enhanced CVD films | APPLIED MATERIALS, INC. | 2002-10-03 | — | — | US | claimed |
| US-12454753-B2 | Compositions and methods using same for deposition of silicon-containing film | VERSUM MATERIALS US, LLC (US) | 2025-10-28 | — | — | US | disclosed |
| US-20240392434-A1 | COMPOSITIONS AND METHODS USING SAME FOR DEPOSITION OF SILICON-CONTAINING FILM | VERSUM MAT US LLC (US) | 2024-11-28 | — | — | US | disclosed |
| CN-114016001-A | Compositions for depositing silicon-containing films and methods of using the same | 弗萨姆材料美国有限责任公司 | 2022-02-08 | — | — | CN | disclosed |
| US-20210140040-A1 | COMPOSITIONS AND METHODS USING SAME FOR DEPOSITION OF SILICON-CONTAINING FILM | VERSUM MATERIALS US, LLC (US) | 2021-05-13 | — | — | US | disclosed |
| US-20190292658-A1 | COMPOSITIONS AND METHODS USING SAME FOR DEPOSITION OF SILICON-CONTAINING FILM | VERSUM MATERIALS US, LLC | 2019-09-26 | — | — | US | disclosed |
| CN-108603287-A | Compositions for depositing silicon-containing films and methods of using the same | 弗萨姆材料美国有限责任公司 | 2018-09-28 | — | — | CN | disclosed |
| US-7399697-B2 | Very low dielectric constant plasma-enhanced CVD films | APPLIED MATERIALS, INC. (US) | 2008-07-15 | — | — | US | disclosed |
| US-20050136240-A1 | Very low dielectric constant plasma-enhanced CVD films | MANDAL ROBERT P (US) | 2005-06-23 | — | — | US | disclosed |
| US-6890639-B2 | Very low dielectric constant plasma-enhanced CVD films | APPLIED MATERIALS, INC. (US) | 2005-05-10 | — | — | US | disclosed |
| US-20020142585-A1 | Very low dielectric constant plasma-enhanced CVD films | APPLIED MATERIALS, INC. | 2002-10-03 | — | — | US | disclosed |