SCHEMBL4841748

SCHEMBL4841748

CCC1COC1COC1CCCC(OCC2OCC2CC)C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4840451 0.85 SMN1; SMN2 (0.31)
SCHEMBL4836572 0.75 SPHK2 (0.31)
SCHEMBL8648314 0.74
SCHEMBL3467973 0.73 SMN1; SMN2 (0.34)
SCHEMBL16470051 0.73 SMN1; SMN2 (0.34)
SCHEMBL730238 0.71 TSHR (0.43)
SCHEMBL6680249 0.71 ALDH1A1 (0.48)
SCHEMBL9358634 0.70
SCHEMBL22471876 0.70 SMN1; SMN2 (0.32)
SCHEMBL4839987 0.69 SMN1; SMN2 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7338737-B2 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-03-04 US disclosed
US-7297452-B2 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-11-20 US disclosed
US-20070254221-A1 Akali-soluble resin, quinone diazide, surfactant mixture of a 3-perfluoroalkylpropane epoxide and polyethersilicones), and a solvent; high-quality display panels with uniformly-coated insulating layers. SAMSUNG DISPLAY CO., LTD. (KR) 2007-11-01 US disclosed
US-20060141393-A1 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. 2006-06-29 US disclosed
US-20060131267-A1 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG DISPLAY CO., LTD. (KR) 2006-06-22 US disclosed