Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL4846758

N.N.N.N.[AlH3].[Ti].[Ti].[Ti].[Ti]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9548318-B1 Connecting to back-plate contacts or diode junctions through a RMG electrode and resulting devices GLOBALFOUNDRIES INC. (KY) 2017-01-17 US claimed
US-9548318-B1 Connecting to back-plate contacts or diode junctions through a RMG electrode and resulting devices GLOBALFOUNDRIES INC. (KY) 2017-01-17 US disclosed
US-8809962-B2 Transistor with reduced parasitic capacitance GLOBALFOUNDRIES INC. (KY) 2014-08-19 US disclosed
US-20130049142-A1 TRANSISTOR WITH REDUCED PARASITIC CAPACITANCE GLOBALFOUNDRIES INC. (KY) 2013-02-28 US disclosed
CN-101000892-B Programmable resistance memory and manufacturing method thereof MACRONIX INT CO LTD 2010-04-14 CN disclosed
US-7467447-B2 Method of manufacturing a SAW device TDK CORPORATION (JP) 2008-12-23 US disclosed
EP-1296451-B1 SAW device and manufacturing method TDK CORP (JP) 2007-12-26 EP disclosed
CN-101000892-A Programmable resistance memory and manufacturing method thereof MACRONIX INT CO LTD (CN) 2007-07-18 CN disclosed
US-20050162039-A1 Saw device and manufacturing method TDK CORPORATION (JP) 2005-07-28 US disclosed
US-6903488-B2 SAW device and manufacturing method TDK CORPORATION (JP) 2005-06-07 US disclosed
US-20030067369-A1 Saw device and manufacturing method TDK CORPORATION (JP) 2003-04-10 US disclosed
EP-1296451-A2 SAW device and manufacturing method TDK Corporation (JP) 2003-03-26 EP disclosed