⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL479594 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL4846758 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL1376347 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL3412516 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL2000641 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL27040595 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL28244231 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL831722 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL10323198 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL14762761 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5666007-A | Interconnect structures for integrated circuits | NATIONAL SEMICONDUCTOR CORPORATION (US) | 1997-09-09 | — | — | US | claimed |
| CN-118284167-A | Display substrate and electronic device | 京东方科技集团股份有限公司 | 2024-07-02 | — | — | CN | disclosed |
| US-20240179950-A1 | DISPLAY SUBSTRATE AND ELECTRONIC APPARATUS | YUNNAN INVENSIGHT OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) | 2024-05-30 | — | — | US | disclosed |
| US-20240179951-A1 | DISPLAY SUBSTRATE AND ELECTRONIC APPARATUS | YUNNAN INVENSIGHT OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) | 2024-05-30 | — | — | US | disclosed |
| CN-118019391-A | Display substrate and electronic device | 京东方科技集团股份有限公司 | 2024-05-10 | — | — | CN | disclosed |
| US-11980069-B2 | Display and display device | BOE TECHNOLOGY GROUP CO., LTD. (CN) | 2024-05-07 | — | — | US | disclosed |
| US-11963406-B2 | Display and display device | BOE TECHNOLOGY GROUP CO., LTD. (CN) | 2024-04-16 | — | — | US | disclosed |
| EP-4280843-A1 | DISPLAY SUBSTRATE AND ELECTRONIC DEVICE | BOE Technology Group Co., Ltd. (CN) | 2023-11-22 | — | — | EP | disclosed |
| EP-4280255-A1 | DISPLAY SUBSTRATE AND ELECTRONIC APPARATUS | BOE Technology Group Co., Ltd. (CN) | 2023-11-22 | — | — | EP | disclosed |
| CN-112703615-B | Display substrate and manufacturing method thereof | 京东方科技集团股份有限公司 | 2023-04-25 | — | — | CN | disclosed |
| CN-101740612-A | Contact structure for semiconductor device having trench shield electrode and method | SEMICONDUCTOR ELEMENT INDUSTRY | 2010-06-16 | — | — | CN | disclosed |
| CN-101740623-A | Semiconductor device having trench shield electrode structure | SEMICONDUCTOR ELEMENT INDUSTRY | 2010-06-16 | — | — | CN | disclosed |
| CN-101740622-A | Trench shielding structure for semiconductor device and method | SEMICONDUCTOR ELEMENT INDUSTRY | 2010-06-16 | — | — | CN | disclosed |
| CN-101740546-A | Deposition structure of metallic layer for improving electric migration performance of aluminum and copper and method for manufacturing same | SHANGHAI HUAHONG NEC ELECT CO | 2010-06-16 | — | — | CN | disclosed |
| US-6413871-B2 | Nitrogen treatment of polished halogen-doped silicon glass | APPLIED MATERIALS, INC. | 2002-07-02 | — | — | US | disclosed |
| US-20010033900-A1 | NITROGEN TREATMENT OF POLISHED HALOGEN-DOPED SILICON GLASS | APPLIED MATERIALS, INC. | 2001-10-25 | — | — | US | disclosed |
| US-5783490-A | Photolithography alignment mark and manufacturing method | VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION (TW) | 1998-07-21 | — | — | US | disclosed |
| US-5559055-A | DECREASING CAPACITANCE BY REPLACING THE INTERLAYER SILICON DIOXIDE WITH AIR | ADVANCED MICRO DEVICES, INC. (US) | 1996-09-24 | — | — | US | disclosed |
| US-5504043-A | SILICIDING, NITRIDING TITANIUM ON SILICON SUBSTRATE IN VACCUM | APPLIED MATERIALS, INC. (US) | 1996-04-02 | — | — | US | disclosed |
| US-5378660-A | Barrier layers and aluminum contacts | APPLIED MATERIALS, INC. (US) | 1995-01-03 | — | — | US | disclosed |