SCHEMBL4855700

SCHEMBL4855700

C=C(C)C(=O)OC1COC1

nearest known ligand 0.46

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.46
TSHR P16473 3/20 0.33
THRB P10828 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3370071 0.92 ALDH1A1 (0.43) ALDH1A1TSHR
SCHEMBL74982 0.84 ALDH1A1 (0.41) ALDH1A1
SCHEMBL4261488 0.83 ALDH1A1 (0.46) ALDH1A1TSHRTHRB
SCHEMBL24486022 0.83 ALDH1A1 (0.46) ALDH1A1TSHRTHRB
SCHEMBL16787498 0.83 ALDH1A1 (0.46) ALDH1A1TSHRTHRB
SCHEMBL17938239 0.82 ALDH1A1 (0.46) ALDH1A1TSHR
SCHEMBL8182848 0.82 ALDH1A1 (0.42) ALDH1A1TSHR
SCHEMBL20972875 0.81 ALDH1A1 (0.39) ALDH1A1
SCHEMBL25278 0.79
SCHEMBL372980 0.79 ALDH1A1 (0.46) ALDH1A1TSHRTHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112241107-A Positive photosensitive resin composition, photosensitive resin film, and display device using same 株式会社东进世美肯 2021-01-19 CN claimed
US-20080054171-A1 Target for Laser Desorption/Ionisation Mass Spectrometry PHYSIKALISCHES BURO STEINMULLER GMBH 2008-03-06 US claimed
WO-2007030849-A1 METHOD FOR DETECTING ORGANIC COMPOUNDS Austria Wirtschaftsservice Gesellschaft mit beschränkter Haftung (AT) 2007-03-22 WO claimed
EP-1738397-A2 TARGET FOR LASER DESORPTION/IONISATION MASS SPECTROMETRY Physikalisches Büro Steinmüller GmbH (AT) 2007-01-03 EP claimed
WO-2005096346-A2 TARGET FOR LASER DESORPTION/IONISATION MASS SPECTROMETRY PHYSIKALISCHES BÜRO STEINMÜLLER GMBH (AT) 2005-10-13 WO claimed
CN-112241107-B Positive photosensitive resin composition, photosensitive resin film and display device using the same 株式会社东进世美肯 2025-03-11 CN disclosed
CN-117858872-A Heterocyclic EGFR inhibitors for the treatment of cancer 缆图药品公司 2024-04-09 CN disclosed
CN-114341282-A Curable composition for inkjet 太阳油墨制造株式会社 2022-04-12 CN disclosed
CN-108290828-B Oxime ester compound having excellent thermal stability, photopolymerization initiator containing the same, and photosensitive resin composition 京仁洋行股份有限公司 2021-01-26 CN disclosed
CN-110872455-A White resin composition, backlight unit and display device 东友精细化工有限公司 2020-03-10 CN disclosed
US-9268218-B2 Photosensitive resin composition for color filter and application thereof CHI MEI CORPORATION (TW) 2016-02-23 US disclosed
CN-105319847-A Photosensitive resin composition for color filter and application thereof CHI MEI CORP 2016-02-10 CN disclosed
US-20080054171-A1 Target for Laser Desorption/Ionisation Mass Spectrometry PHYSIKALISCHES BURO STEINMULLER GMBH 2008-03-06 US disclosed
US-7320854-B2 Mixture of oxide particles, polymerizable compound,radiation sensitive decomposer and releasing agent JSR CORPORATION (JP) 2008-01-22 US disclosed
US-7226721-B2 Underlayer coating forming composition for lithography containing compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2007-06-05 US disclosed
WO-2007030849-A1 METHOD FOR DETECTING ORGANIC COMPOUNDS Austria Wirtschaftsservice Gesellschaft mit beschränkter Haftung (AT) 2007-03-22 WO disclosed
US-20060210915-A1 Composition for forming lower layer film for lithography comprising compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2006-09-21 US disclosed
EP-1662769-A1 COMPOSITION FOR FORMING LOWER LAYER FILM FOR LITHOGRAPHY COMPRISING COMPOUND HAVING PROTECTED CARBOXYL GROUP Nissan Chemical Industries, Ltd. (JP) 2006-05-31 EP disclosed
EP-1494072-A2 Radiation sensitive refractive index changing composition, pattern forming method and optical material JSR Corporation (JP) 2005-01-05 EP disclosed
US-20040265737-A1 Radiation sensitive refractive index changing composition, pattern forming method and optical material JSR CORPORATION (JP) 2004-12-30 US disclosed