SCHEMBL4860266

SCHEMBL4860266

CC=Cc1cc(OCC2CO2)c(OCC2CO2)c(OCC2CO2)c1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.45
GLA P06280 1/20 0.45
TP53 P04637 3/20 0.40
TSHR P16473 3/20 0.40
SMN1; SMN2 Q16637 3/20 0.40
HIF1A Q16665 2/20 0.40
CYP3A4 P08684 1/20 0.40
TDP1 Q9NUW8 1/20 0.38
HPGD P15428 4/20 0.36
MAPT P10636 4/20 0.36
LMNA P02545 3/20 0.36
PKM P14618 2/20 0.36
MEN1 O00255 2/20 0.36
KMT2A Q03164 2/20 0.36
CYP1A2 P05177 1/20 0.36
PPARG P37231 1/20 0.36
GAA P10253 1/20 0.36
ATM Q13315 1/20 0.36
VDR P11473 1/20 0.32
POLB P06746 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24161879 0.84 TUBB1 (0.38) ALDH1A1GLATP53TSHRSMN1; SMN2
SCHEMBL3129875 0.83 MAPT (0.48) ALDH1A1GLATP53TSHRSMN1; SMN2
SCHEMBL17857313 0.83 TUBB1 (0.47) ALDH1A1GLATP53TSHRSMN1; SMN2
SCHEMBL3132628 0.81 ALDH1A1 (0.44) ALDH1A1GLATP53TSHRSMN1; SMN2
SCHEMBL19524091 0.81 ALDH1A1 (0.44) ALDH1A1GLATP53TSHRSMN1; SMN2
SCHEMBL3132669 0.81 ALDH1A1 (0.54) ALDH1A1GLATP53TSHRSMN1; SMN2
SCHEMBL11594866 0.80 MAPT (0.54) ALDH1A1GLASMN1; SMN2HPGDMAPT
SCHEMBL5048202 0.80 POLB (0.56) ALDH1A1SMN1; SMN2HPGDMAPTLMNA
SCHEMBL31596324 0.80 POLB (0.56) ALDH1A1SMN1; SMN2HPGDMAPTLMNA
SCHEMBL4859400 0.80 ALDH1A1 (0.43) ALDH1A1GLATP53TSHRSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4619477-A1 COATING COMPOSITION PPG Europe B.V. (NL) 2025-09-24 EP disclosed
EP-4126989-B1 COATING COMPOSITION COMPRISING A FILM-FORMING RESIN AND A CROSSLINKING MATERIAL PPG IND OHIO INC (US) 2025-07-09 EP disclosed
EP-4512836-A2 A CROSSLINKING MATERIAL AND USES THEREOF PPG Industries Ohio, Inc. (US) 2025-02-26 EP disclosed
WO-2025017155-A1 COATING COMPOSITION PPG EUROPE B.V. (NL) 2025-01-23 WO disclosed
EP-4495193-A1 COATING COMPOSITION PPG Europe B.V. (NL) 2025-01-22 EP disclosed
US-20250019560-A1 ACRYLIC MATERIALS AND USES THEREOF PPG INDUSTRIES OHIO, INC. (US) 2025-01-16 US disclosed
EP-4126988-B1 A PACKAGE COMPRISING A COATING COMPOSITOIN COMPRISING A FILM-FORMING RESIN AND A CROSSLINKING MATERIAL PPG IND OHIO INC (US) 2025-01-08 EP disclosed
EP-4437053-A1 ACRYLIC MATERIALS AND USES THEREOF PPG Industries Ohio Inc. (US) 2024-10-02 EP disclosed
CN-115551903-B Cross-linked material and use thereof PPG工业俄亥俄公司 2024-03-15 CN disclosed
US-20240045329-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND TORAY INDUSTRIES, INC. (JP) 2024-02-08 US disclosed
US-6797450-B2 ALKALI-SOLUBLE RESIN HAVING NO EPOXY GROUP AND A 1,2-QUINONEDIAZIDE COMPOUND JSR CORPORATION (JP) 2004-09-28 US disclosed
EP-1312982-A1 RADIATION-SENSITIVE COMPOSITION, INSULATING FILM AND ORGANIC EL DISPLAY ELEMENT JSR Corporation (JP) 2003-05-21 EP disclosed
US-20030068574-A1 Radiation sensitive resin composition, rib, rib forming method and display element JSR CORPORATION (JP) 2003-04-10 US disclosed
EP-1296186-A1 Radiation sensitive resin composition, rib, rib forming method and display element JSR Corporation (JP) 2003-03-26 EP disclosed
US-20030054284-A1 Radiation-sensitive composition, insulating film and organic el display element JSR CORPORATION (JP) 2003-03-20 US disclosed
EP-0880075-B1 Radiation sensitive resin composition JSR CORP (JP) 2001-10-17 EP disclosed
US-6168908-B1 COATING AN ALKALI-SOLUBLE THERMOSETTING RESIN ON A SUBSTRATE, AND BAKING IT, COATING A RADIATION SENSITIVE RESIN ON THE COATED FILM, AND BAKING, EXPOSING THE RADIATION SENSITIVE FILM TO A RADIATION THROUGH A MASK AND BAKING, DEVELOPING JSR CORPORATION (JP) 2001-01-02 US disclosed
US-5958648-A Radiation sensitive resin composition JSR CORPORATION (JP) 1999-09-28 US disclosed
EP-0908780-A1 Process for forming a cured film of a thermosetting resin JSR Corporation (JP) 1999-04-14 EP disclosed
EP-0880075-A1 Radiation sensitive resin composition JSR Corporation (JP) 1998-11-25 EP disclosed