SCHEMBL4860937

SCHEMBL4860937

COc1cc(C)cc2ooc12

nearest known ligand 0.48

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ACHE P22303 2/20 0.48
CSF1R P07333 1/20 0.37
ERN1 O75460 1/20 0.36
CNR2 P34972 9/20 0.36
GPR55 Q9Y2T6 1/20 0.36
ALDH1A1 P00352 2/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
CA2 P00918 1/20 0.34
CYP3A4 P08684 1/20 0.33
SYK P43405 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2611542 0.68 ACHE (0.65) ACHEERN1CNR2ALDH1A1SMN1; SMN2
SCHEMBL14197696 0.67 ACHE (0.45) ACHEERN1ALDH1A1SMN1; SMN2CYP3A4
SCHEMBL15424071 0.66 ACHE (0.62) ACHEERN1CNR2GPR55ALDH1A1
SCHEMBL171116 0.66 ACHE (1.00) ACHEALDH1A1CYP3A4
SCHEMBL806505 0.65 ALDH1A1 (0.47) ACHEALDH1A1SMN1; SMN2CYP3A4
SCHEMBL20837264 0.64 ACHE (0.42) ACHEERN1CNR2GPR55ALDH1A1
SCHEMBL562147 0.64 ERN1 (0.63) ACHEERN1ALDH1A1SMN1; SMN2CA2
SCHEMBL5028318 0.64 ACHE (0.59) ACHEERN1ALDH1A1SMN1; SMN2CYP3A4
SCHEMBL12258796 0.64 ACHE (0.59) ACHEERN1ALDH1A1SMN1; SMN2CA2
SCHEMBL8117527 0.64 ACHE (0.59) ACHEERN1CNR2ALDH1A1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2008151063-A2 HIGH DEFINITION VERSATILE STEREOLITHIC METHOD AND MATERIAL MEISNER MILTON (US) 2008-12-11 WO claimed
US-7183361-B2 Include crystalline polymers wherein crystallinity is provided by a linear long chain aliphatic carboxylic acid on a base polymer; polymers can either have a hyperbranched or dendritic structure or have a comb-like structure REICHHOLD, INC. (US) 2007-02-27 US claimed
EP-1685167-A4 RHEOLOGY MODIFYING AGENTS AND METHODS OF USING THE SAME REICHHOLD INC (US) 2006-12-27 EP claimed
EP-1685167-A2 RHEOLOGY MODIFYING AGENTS AND METHODS OF USING THE SAME Reichhold, Inc. (US) 2006-08-02 EP claimed
WO-2005030809-A2 RHEOLOGY MODIFYING AGENTS AND METHODS OF USING THE SAME REICHHOLD, INC. (US) 2005-04-07 WO claimed
US-20050069799-A1 Rheology modifying agents and methods of using the same REICHHOLD, INC. 2005-03-31 US claimed
US-5439766-A Cationically polymerized epoxy based coating combined with conventional epoxy glass substrate INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1995-08-08 US claimed
EP-3916062-B1 METHOD AND APPARATUS FOR ADHESIVE DEPOSITION ZEPHYROS INC (US) 2024-11-06 EP disclosed
EP-3916062-A1 METHOD AND APPARATUS FOR ADHESIVE DEPOSITION Zephyros Inc. (US) 2021-12-01 EP disclosed
EP-2880113-B1 METHOD AND APPARATUS FOR ADHESIVE DEPOSITION ZEPHYROS INC (US) 2021-06-30 EP disclosed
EP-3086940-A2 TOUGHENED COMPOSITE MATERIALS AND METHODS OF MANUFACTURING THEREOF Cytec Industries Inc. (US) 2016-11-02 EP disclosed
US-9422458-B2 Method and apparatus for adhesive deposition ZEPHYROS, INC. (US) 2016-08-23 US disclosed
US-20150174872-A1 TOUGHENED COMPOSITE MATERIALS AND METHODS OF MANUFACTURING THEREOF CYTEC INDUSTRIES INC 2015-06-25 US disclosed
US-6040631-A Method of improved cavity BGA circuit package INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2000-03-21 US disclosed
US-5439766-A Cationically polymerized epoxy based coating combined with conventional epoxy glass substrate INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1995-08-08 US disclosed
US-5439766-A Cationically polymerized epoxy based coating combined with conventional epoxy glass substrate INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1995-08-08 US disclosed
US-5112715-A Toner compositions containing a multi-purpose additive EASTMAN KODAK COMPANY (US) 1992-05-12 US disclosed
EP-0162698-B1 SOLDERABLE CONDUCTIVE COMPOSITIONS, METHODS FOR THEIR PREPARATION, AND SUBSTRATES COATED WITH THEM ELECTRO MATERIALS CORP. OF AMERICA (US) 1990-04-25 EP disclosed
EP-0162698-A1 Solderable conductive compositions, methods for their preparation, and substrates coated with them ELECTRO MATERIALS CORP. OF AMERICA (US) 1985-11-27 EP disclosed
US-4548879-A Solderable polymer thick films ROHM AND HAAS COMPANY (US) 1985-10-22 US disclosed