Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 13/20 | 0.51 |
| ▸ | HSP90AA1 | P07900 | 4/20 | 0.47 |
| ▸ | FAAH | O00519 | 4/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | PKM | P14618 | 1/20 | 0.39 |
| ▸ | HTT | P42858 | 1/20 | 0.39 |
| ▸ | ATM | Q13315 | 1/20 | 0.39 |
| ▸ | HPN | P05981 | 1/20 | 0.37 |
| ▸ | CCR6 | P51684 | 1/20 | 0.34 |
| ▸ | G6PD | P11413 | 1/20 | 0.34 |
| ▸ | TLR9 | Q9NR96 | 1/20 | 0.34 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29573295 | 1.00 | MGLL (0.51) | MGLLHSP90AA1FAAHALDH1A1PKM | |
| SCHEMBL31179931 | 0.96 | MGLL (0.55) | MGLLHSP90AA1FAAHALDH1A1PKM | |
| SCHEMBL486881 | 0.94 | MGLL (0.52) | MGLLHSP90AA1FAAHALDH1A1PKM | |
| SCHEMBL486644 | 0.90 | MGLL (0.49) | MGLLHSP90AA1FAAHALDH1A1PKM | |
| SCHEMBL29573130 | 0.84 | MGLL (0.54) | MGLLHSP90AA1FAAHALDH1A1PKM | |
| SCHEMBL486784 | 0.84 | MGLL (0.54) | MGLLHSP90AA1FAAHALDH1A1PKM | |
| SCHEMBL31179959 | 0.84 | MGLL (0.59) | MGLLHSP90AA1FAAHALDH1A1PKM | |
| SCHEMBL8735089 | 0.82 | MGLL (0.51) | MGLLHSP90AA1FAAHALDH1A1PKM | |
| SCHEMBL26604968 | 0.80 | MGLL (0.49) | MGLLHSP90AA1FAAHALDH1A1PKM | |
| SCHEMBL486882 | 0.80 | MGLL (0.49) | MGLLHSP90AA1FAAHALDH1A1PKM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5484948-A | FOR MANUFACTURING POLYIMIDES | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-01-16 | — | — | US | claimed |
| EP-0425265-B1 | Aromatic diamine compounds, bismaleimide compounds, thermosetting resins forming compositions therefrom, resins therefrom, and methods for their preparation | MITSUI TOATSU CHEMICALS (JP) | 1994-08-03 | — | — | EP | claimed |
| EP-0425265-A1 | Aromatic diamine compounds, bismaleimide compounds, thermosetting resins forming compositions therefrom, resins therefrom, and methods for their preparation | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1991-05-02 | — | — | EP | claimed |
| WO-2024150769-A1 | WIRING FORMING MEMBER, METHOD FOR FORMING WIRING LAYER, AND WIRING FORMED MEMBER | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| EP-4394000-A1 | THERMOSETTING RESIN COMPOSITION AND HEAT CURED PRODUCT | Polyplastics-Evonik Corporation (JP) | 2024-07-03 | — | — | EP | disclosed |
| EP-4368674-A1 | RESIN COMPOSITION, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | Resonac Corporation (JP) | 2024-05-15 | — | — | EP | disclosed |
| WO-2024080195-A1 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2024-04-18 | — | — | WO | disclosed |
| US-20240092958-A1 | THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND HIGH-SPEED COMMUNICATION COMPATIBLE MODULE | RESONAC CORPORATION (JP) | 2024-03-21 | — | — | US | disclosed |
| WO-2023243676-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2023-12-21 | — | — | WO | disclosed |
| US-20230391939-A1 | RESIN COMPOSITION, PREPREG, LAMINATED PLATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2023-12-07 | — | — | US | disclosed |
| WO-2023224021-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2023-11-23 | — | — | WO | disclosed |
| US-8735733-B2 | Resin composition, prepreg laminate obtained with the same and printed-wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-05-27 | — | — | US | disclosed |
| US-20140000948-A1 | RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND PREPREG USING SAME | RESONAC CORPORATION (JP) | 2014-01-02 | — | — | US | disclosed |
| US-20130330563-A1 | MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-12-12 | — | — | US | disclosed |
| EP-2666826-A1 | RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND PREPREG USING SAME | Hitachi Chemical Co., Ltd. (JP) | 2013-11-27 | — | — | EP | disclosed |
| EP-2666804-A1 | MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME | Hitachi Chemical Co., Ltd. (JP) | 2013-11-27 | — | — | EP | disclosed |
| US-20130260155-A1 | RESIN COMPOSITION, AND PREPREG AND LAMINATE USING SAME | AIR WATER INC (JP) | 2013-10-03 | — | — | US | disclosed |
| US-20120247820-A1 | RESIN COMPOSITION, PREPREG LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD | RESONAC CORPORATION (JP) | 2012-10-04 | — | — | US | disclosed |
| US-20120077401-A1 | RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-03-29 | — | — | US | disclosed |
| EP-2412743-A1 | THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME | Hitachi Chemical Company, Ltd. (JP) | 2012-02-01 | — | — | EP | disclosed |