SCHEMBL4873076

SCHEMBL4873076

CCCCCCCCCCCCCCCCCCC(CCC)c1ccccc1

nearest known ligand 0.49

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
NR1I2 O75469 1/20 0.46
HTR2A P28223 1/20 0.45
CSNK1E P49674 1/20 0.44
SIGMAR1 Q99720 1/20 0.43
NAAA Q02083 2/20 0.42
OPRM1 P35372 2/20 0.42
OPRD1 P41143 2/20 0.42
OPRK1 P41145 2/20 0.42
OPRL1 P41146 2/20 0.42
CYSLTR2 Q9NS75 1/20 0.42
CYSLTR1 Q9Y271 1/20 0.42
AOC3 Q16853 1/20 0.41
KCNH2 Q12809 1/20 0.41
ASAH1 Q13510 1/20 0.41
CYP19A1 P11511 2/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21633720 1.00 NR1I2 (0.46) NR1I2HTR2ACSNK1ESIGMAR1NAAA
SCHEMBL7614200 1.00 NR1I2 (0.46) NR1I2HTR2ACSNK1ESIGMAR1NAAA
SCHEMBL31175819 1.00 NR1I2 (0.46) NR1I2HTR2ACSNK1ESIGMAR1NAAA
SCHEMBL1331317 1.00 NR1I2 (0.46) NR1I2HTR2ACSNK1ESIGMAR1NAAA
SCHEMBL8509029 1.00 NR1I2 (0.46) NR1I2HTR2ACSNK1ESIGMAR1NAAA
SCHEMBL3072581 1.00 NR1I2 (0.46) NR1I2HTR2ACSNK1ESIGMAR1NAAA
SCHEMBL4181323 1.00 NR1I2 (0.46) NR1I2HTR2ACSNK1ESIGMAR1NAAA
SCHEMBL5423814 0.98 SIGMAR1 (0.44) NR1I2HTR2ACSNK1ESIGMAR1NAAA
Fluoride SCHEMBL9717306 0.96 SIGMAR1 (0.43) NR1I2HTR2ACSNK1ESIGMAR1NAAA
SCHEMBL23849703 0.96 NR1I2 (0.49) NR1I2HTR2ACSNK1ESIGMAR1NAAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-RE40218-E1 Electro-chemical deposition system and method of electroplating on substrates LANDAU UZIEL 2008-04-08 US disclosed
EP-0991795-B1 ELECTRO-CHEMICAL DEPOSITION SYSTEM AND METHOD OF ELECTROPLATING ON SUBSTRATES APPLIED MATERIALS INC (US) 2006-02-22 EP disclosed
US-6261433-B1 CELL COMPRISING SUBSTRATE HOLDER, CATHODE ELECTRICALLY CONTACTING SUBSTRATE PLATING SURFACE, ELECTROLYTE CONTAINER HAVING ELECTROLYTE INLET AND OUTLET AND OPENING ADAPTED TO RECEIVE SUBSTRATE, ANODE ELECTRICALLY CONNECTED TO ELECTROLYTE APPLIED MATERIALS, INC. 2001-07-17 US disclosed
EP-0991795-A1 ELECTRO-CHEMICAL DEPOSITION SYSTEM AND METHOD OF ELECTROPLATING ON SUBSTRATES Applied Materials, Inc. (US) 2000-04-12 EP disclosed
WO-1999054527-A2 ELECTRO-CHEMICAL DEPOSITION SYSTEM AND METHOD OF ELECTROPLATING ON SUBSTRATES APPLIED MATERIALS, INC. (US) 1999-10-28 WO disclosed