SCHEMBL487332

SCHEMBL487332

CCO[Si](OC(C)=O)(OC(C)=O)OC(C)=O

nearest known ligand 0.43

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.43
LMNA P02545 1/20 0.43
HSD17B10 Q99714 1/20 0.43
TSHR P16473 2/20 0.36
TDP1 Q9NUW8 1/20 0.32
ALOX15 P16050 1/20 0.31
MGAM O43451 1/20 0.31
GAA P10253 1/20 0.31
SI P14410 1/20 0.31
MGAM2 Q2M2H8 1/20 0.31
SOAT1 P35610 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL502559 0.95 ALDH1A1 (0.43) ALDH1A1LMNAHSD17B10TSHRTDP1
SCHEMBL487241 0.95 ALDH1A1 (0.43) ALDH1A1LMNAHSD17B10TSHRTDP1
SCHEMBL3915176 0.92 ALDH1A1 (0.42) ALDH1A1LMNAHSD17B10TSHRTDP1
SCHEMBL3911401 0.92 ALDH1A1 (0.42) ALDH1A1LMNAHSD17B10TSHRTDP1
SCHEMBL7840079 0.88 ALDH1A1 (0.39) ALDH1A1LMNAHSD17B10TSHR
Acetone SCHEMBL17157186 0.80 ALDH1A1 (0.43) ALDH1A1LMNAHSD17B10TSHRTDP1
SCHEMBL29249906 0.80 ALDH1A1 (0.39) ALDH1A1LMNAHSD17B10TSHR
Acetic Acid SCHEMBL28481428 0.78 FFAR3 (0.41) ALDH1A1LMNAHSD17B10TSHRTDP1
SCHEMBL728864 0.77 ALDH1A1 (0.42) ALDH1A1LMNAHSD17B10TSHRTDP1
SCHEMBL15661596 0.77 ALDH1A1 (0.36) ALDH1A1LMNAHSD17B10TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115584263-A Chemical etching composition and application thereof 安集微电子(上海)有限公司 2023-01-10 CN claimed
EP-1661960-B1 COATING COMPOSITION AND LOW DIELECTRIC SILICEOUS MATERIAL PRODUCED BY USING SAME AZ ELECTRONIC MATERIALS USA (US) 2012-07-25 EP claimed
US-7754003-B2 Coating composition and low dielectric siliceous material produced by using same AZ ELECTRONIC MATERIALS USA CORP. (US) 2010-07-13 US claimed
WO-2024177099-A1 POLYESTER RESIN COMPOSITION, LAYERED PRODUCT, PACKAGING MATERIAL, AND GAS BARRIER MATERIAL 東洋紡株式会社 2024-08-29 WO disclosed
WO-2024177097-A1 HYDROXYL GROUP-CONTAINING POLYAMIDE RESIN COMPOSITION, LAMINATE, PACKAGING MATERIAL, AND GAS BARRIER MATERIAL 東洋紡株式会社 2024-08-29 WO disclosed
CN-118050962-A External additive for toner and toner 佳能株式会社 2024-05-17 CN disclosed
CN-118050963-A External additive for toner and toner 佳能株式会社 2024-05-17 CN disclosed
US-20230045816-A1 THERMOELECTRIC CONVERSION STRUCTURE ASAHI RUBBER INC. (JP) 2023-02-16 US disclosed
CN-115584263-A Chemical etching composition and application thereof 安集微电子(上海)有限公司 2023-01-10 CN disclosed
EP-4092767-A1 THERMOELECTRIC CONVERSION STRUCTURE Asahi Rubber Inc. (JP) 2022-11-23 EP disclosed
US-10316046-B2 Method for producing acyloxysilanes, acyloxysilanes obtained thereby, and use of same NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 2019-06-11 US disclosed
WO-2008099904-A1 SILANE COMPOUND, PRODUCTION METHOD THEREOF, AND RESIN COMPOSITION CONTAINING SILANE COMPOUND NIPPON SHOKUBAI CO., LTD. (JP) 2008-08-21 WO disclosed
US-20060246303-A1 Coating composition and low dielectric siliceous material produced by using same MERCK PATENT GMBH (DE) 2006-11-02 US disclosed
US-20060167164-A1 Fire retardant resin composition, method of its production, shaped articles comprising the same, and silica NIPPON SHOKUBAI CO., LTD. (JP) 2006-07-27 US disclosed
EP-1661960-A1 COATING COMPOSITION AND LOW DIELECTRIC SILICEOUS MATERIAL PRODUCED BY USING SAME AZ Electronic Materials USA Corp. (US) 2006-05-31 EP disclosed
WO-2006038735-A1 RESIN COMPOSITION FOR OPTICAL PACKAGING MATERIAL AND PROCESS FOR PREPARING THE SAME, AND OPTICAL PACKAGING MATERIAL, OPTICAL PACKAGING COMPONENT, AND OPTICAL MODULE NIPPON SHOKUBAI CO., LTD. (JP) 2006-04-13 WO disclosed
EP-1626065-A1 Resin composition, method of its composition, and cured formulation Nippon Shokubai Co., Ltd. (JP) 2006-02-15 EP disclosed
US-20060029811-A1 mixing a phenolic compound containing the inorganic microfine particle(SiO2) and a compound containing at least one of the glycidyl group and/or an epoxy group containing the inorganic microfine particle; fireproofing; good mechanical properties; heat resistance; automobiles, construction, electronics NIPPON SHOKUBAI CO., LTD. (JP) 2006-02-09 US disclosed
EP-1507829-A1 FIRE RETARDANT RESIN COMPOSITION, METHOD OF ITS PRODUCTION, SHAPED ARTICLES COMPRISING THE SAME, AND SILICA Nippon Shokubai Co., Ltd. (JP) 2005-02-23 EP disclosed
WO-2003099934-A1 FIRE RETARDANT RESIN COMPOSITION, METHOD OF ITS PRODUCTION, SHAPED ARTICLES COMPRISING THE SAME, AND SILICA NIPPON SHOKUBAI CO., LTD. (JP) 2003-12-04 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10316046-B2 Method for producing acyloxysilanes, acyloxysilanes obtained thereby, and use of same COASY, AGPS, CA7 ALDH1A1 176/4885LMNA 3378/4885HSD17B10 81/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.