⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1218128 | 0.97 | — | — | |
| SCHEMBL487648 | 0.93 | — | — | |
| Fluoride SCHEMBL28360298 | 0.93 | — | — | |
| SCHEMBL3248535 | 0.93 | — | — | |
| SCHEMBL1022557 | 0.93 | — | — | |
| SCHEMBL7703497 | 0.93 | — | — | |
| SCHEMBL1024180 | 0.93 | — | — | |
| SCHEMBL9131975 | 0.93 | — | — | |
| SCHEMBL9155181 | 0.93 | — | — | |
| SCHEMBL14450818 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2180019-B1 | Resin composition, method of its composition, and cured formulation | NIPPON CATALYTIC CHEM IND (JP) | 2012-02-01 | — | — | EP | disclosed |
| US-7723407-B2 | mixing a phenolic compound containing the inorganic microfine particle(SiO2) and a compound containing at least one of the glycidyl group and/or an epoxy group containing the inorganic microfine particle; fireproofing; good mechanical properties; heat resistance; automobiles, construction, electronics | NIPPON SHOKUBAI CO., LTD. (JP) | 2010-05-25 | — | — | US | disclosed |
| EP-2180019-A1 | Resin composition, method of its composition, and cured formulation | Nippon Shokubai Co., Ltd. (JP) | 2010-04-28 | — | — | EP | disclosed |
| EP-1626065-B1 | Resin composition, method of its composition, and cured formulation | NIPPON CATALYTIC CHEM IND (JP) | 2010-01-20 | — | — | EP | disclosed |
| EP-1626065-A1 | Resin composition, method of its composition, and cured formulation | Nippon Shokubai Co., Ltd. (JP) | 2006-02-15 | — | — | EP | disclosed |
| US-20060029811-A1 | mixing a phenolic compound containing the inorganic microfine particle(SiO2) and a compound containing at least one of the glycidyl group and/or an epoxy group containing the inorganic microfine particle; fireproofing; good mechanical properties; heat resistance; automobiles, construction, electronics | NIPPON SHOKUBAI CO., LTD. (JP) | 2006-02-09 | — | — | US | disclosed |