SCHEMBL4899794

SCHEMBL4899794

CN(C)Cc1cc(C(C)(C)C)c(O)cc1C(C)(C)C

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALOX15 P16050 7/20 0.60
ALDH1A1 P00352 6/20 0.60
CYP1A2 P05177 3/20 0.60
KDM4E B2RXH2 2/20 0.60
MAPT P10636 2/20 0.60
SMN1; SMN2 Q16637 2/20 0.60
ATP2A2 P16615 1/20 0.60
ATP2A3 Q93084 1/20 0.60
GAA P10253 3/20 0.54
TDP1 Q9NUW8 2/20 0.54
MEN1 O00255 1/20 0.54
POLB P06746 1/20 0.54
THRB P10828 1/20 0.54
G6PD P11413 1/20 0.54
PABPC1 P11940 1/20 0.54
KMT2A Q03164 1/20 0.54
HKDC1 Q2TB90 1/20 0.54
L3MBTL1 Q9Y468 1/20 0.54
LMNA P02545 3/20 0.53
CYP2C19 P33261 3/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29442910 1.00 ALOX15 (0.60) ALOX15ALDH1A1CYP1A2KDM4EMAPT
SCHEMBL3628725 0.81 ALOX15 (0.68) ALOX15ALDH1A1CYP1A2KDM4EMAPT
SCHEMBL1274160 0.80 ALDH1A1 (0.60) ALOX15ALDH1A1CYP1A2KDM4EMAPT
SCHEMBL11007029 0.79 ALDH1A1 (0.65) ALOX15ALDH1A1CYP1A2KDM4EMAPT
SCHEMBL8670928 0.79 ALDH1A1 (0.65) ALOX15ALDH1A1CYP1A2KDM4EMAPT
SCHEMBL25400452 0.79 ALDH1A1 (0.48) ALOX15ALDH1A1CYP1A2KDM4EMAPT
SCHEMBL38604 0.78 ALOX15 (1.00) ALOX15ALDH1A1CYP1A2KDM4EMAPT
SCHEMBL27463980 0.76 ALDH1A1 (0.60) ALOX15ALDH1A1CYP1A2KDM4EMAPT
SCHEMBL30501539 0.76 ALDH1A1 (0.60) ALOX15ALDH1A1CYP1A2KDM4EMAPT
SCHEMBL5072462 0.76 ALDH1A1 (0.58) ALOX15ALDH1A1CYP1A2KDM4EMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117866377-A Polyformaldehyde composite material and preparation method and application thereof 金发科技股份有限公司 2024-04-12 CN disclosed
CN-115975354-A PBT composite material and preparation method and application thereof 金发科技股份有限公司 2023-04-18 CN disclosed
CN-115960434-A Wear-resistant polyformaldehyde composition as well as preparation method and application thereof 金发科技股份有限公司 2023-04-14 CN disclosed
CN-115948019-A Polyformaldehyde composition as well as preparation method and application thereof 金发科技股份有限公司 2023-04-11 CN disclosed
CN-115895179-A Fluorine-containing wear-resistant polyformaldehyde composition as well as preparation method and application thereof 金发科技股份有限公司 2023-04-04 CN disclosed
CN-115746545-A Polyamide composition and preparation method and application thereof 金发科技股份有限公司 2023-03-07 CN disclosed
CN-115746552-A Nylon composite material and preparation method and application thereof 金发科技股份有限公司 2023-03-07 CN disclosed
CN-115678278-A PPS composite material and preparation method and application thereof 金发科技股份有限公司 2023-02-03 CN disclosed
CN-115651384-A PC/ABS alloy and preparation method and application thereof 金发科技股份有限公司 2023-01-31 CN disclosed
CN-114921078-A Transparent PC/PBT alloy and preparation method and application thereof 金发科技股份有限公司 2022-08-19 CN disclosed
CN-114231031-A Foamed polyphenylene sulfide composition and preparation method and application thereof 金发科技股份有限公司 2022-03-25 CN disclosed
CN-114181523-A Polyamide composite material and preparation method and application thereof 金发科技股份有限公司 2022-03-15 CN disclosed
CN-114085500-A Polyester composition and preparation method and application thereof 金发科技股份有限公司 2022-02-25 CN disclosed
EP-2940074-B1 CARBON NANOTUBE-POLYOXYMETHYLENE RESIN COMPOSITION HAVING EXCELLENT ELECTRICAL CONDUCTIVITY AND IMPROVED PROCESSABILITY PROPERTIES AND HEAT STABILITY, AND MOLDED ARTICLE THEREOF KOREA ENG PLASTICS CO LTD (KR) 2017-08-02 EP disclosed
CN-105102535-A Carbon nanotube-polyoxymethylene resin composition having excellent electrical conductivity and improved processability and thermal stability and molded article formed from the same KOREA ENG PLASTICS CO LTD 2015-11-25 CN disclosed
US-20150318072-A1 CARBON NANOTUBE-POLYOXYMETHYLENE RESIN COMPOSITION HAVING EXCELLENT ELECTRICAL CONDUCTIVITY AND IMPROVED PROCESSABILITY AND HEAT STABILITY, AND MOLDED ARTICLE FORMED THEREFROM KOREA ENGINEERING PLASTICS CO., LTD. (KR) 2015-11-05 US disclosed
EP-2940074-A1 CARBON NANOTUBE-POLYOXYMETHYLENE RESIN COMPOSITION HAVING EXCELLENT ELECTRICAL CONDUCTIVITY AND IMPROVED PROCESSING PROPERTIES AND HEAT STABILITY, AND MOLDED ARTICLE THEREOF Korea Engineering Plastics Co., Ltd (KR) 2015-11-04 EP disclosed
US-20080097012-A1 Polyoxymethylene Resin Composition Having An Excellent Heat Stability KOREA ENGINEERING PLASTIC CO., LTD. 2008-04-24 US disclosed
WO-2006080696-A1 POLYOXYMETHYLENE RESIN COMPOSITION HAVING AN EXCELLENT HEAT STABILITY KOREA ENGINEERING PLASTICS CO., LTD. (KR) 2006-08-03 WO disclosed
WO-2005026259-A1 POLYOXYMETHYLENE RESIN COMPOSITION WITH EXCELLENT HEAT STABILITY KOREA ENGINEERING PLASTICS CO., LTD. (KR) 2005-03-24 WO disclosed