SCHEMBL4948908

SCHEMBL4948908

C=C(C)C(=O)OCCOc1ccc(C2(c3ccc(OCCOC(=O)C(=C)C)c(CC)c3)c3ccccc3-c3ccccc32)cc1CC

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.37
ESR2 Q92731 1/20 0.37
THRB P10828 1/20 0.35
L3MBTL1 Q9Y468 3/20 0.34
MAPT P10636 2/20 0.34
NPSR1 Q6W5P4 1/20 0.34
KDM4E B2RXH2 2/20 0.34
POLB P06746 2/20 0.33
APEX1 P27695 1/20 0.33
HTT P42858 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
LTB4R Q15722 2/20 0.33
LTB4R2 Q9NPC1 1/20 0.33
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
TSHR P16473 2/20 0.32
ALDH1A1 P00352 1/20 0.32
PDK2 Q15119 2/20 0.31
MAPK1 P28482 1/20 0.31
MCHR1 Q99705 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4956473 0.95 TDP1 (0.37) ESR1ESR2THRBL3MBTL1MAPT
SCHEMBL6321833 0.94 PPARG (0.36) ESR1ESR2THRBTSHR
SCHEMBL15356213 0.92 TSHR (0.37) ESR1ESR2THRBL3MBTL1MAPT
SCHEMBL28295187 0.92 ESR1 (0.36) ESR1ESR2THRBMAPTKDM4E
SCHEMBL4955324 0.90 ESR1 (0.38) ESR1ESR2MAPTKDM4EPOLB
SCHEMBL819025 0.90 ESR1 (0.39) ESR1ESR2THRBL3MBTL1MAPT
SCHEMBL6322728 0.90 PPARG (0.39) ESR1ESR2POLBAPEX1HTT
SCHEMBL2231834 0.88 ESR1 (0.46) ESR1ESR2THRBL3MBTL1MAPT
SCHEMBL15356210 0.88 POLB (0.39) POLBAPEX1HTTTDP1TSHR
SCHEMBL19009924 0.87 THRB (0.38) ESR1ESR2THRBMAPTKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023188978-A1 CURABLE COMPOSITION, CURED PRODUCT, MOLDED BODY, AND OPTICAL MATERIAL 三井化学株式会社 2023-10-05 WO claimed
WO-2023188978-A1 CURABLE COMPOSITION, CURED PRODUCT, MOLDED BODY, AND OPTICAL MATERIAL 三井化学株式会社 2023-10-05 WO disclosed
US-10611869-B2 Curable composition and cured product AGC Inc. (JP) 2020-04-07 US disclosed
US-20190218325-A1 CURABLE COMPOSITION AND CURED PRODUCT AGC Inc. (JP) 2019-07-18 US disclosed
US-9574106-B2 Optical element material and method for producing same MARUZEN PETROCHEMICAL CO., LTD. (JP) 2017-02-21 US disclosed
US-9574106-B2 Optical element material and method for producing same MARUZEN PETROCHEMICAL CO., LTD. (JP) 2017-02-21 US disclosed
US-9399693-B2 Resin composition for photoimprinting, pattern forming process and etching mask MARUZEN PETROCHEMICAL CO., LTD. (JP) 2016-07-26 US disclosed
US-9399693-B2 Resin composition for photoimprinting, pattern forming process and etching mask MARUZEN PETROCHEMICAL CO., LTD. (JP) 2016-07-26 US disclosed
US-20140287219-A1 OPTICAL ELEMENT MATERIAL AND METHOD FOR PRODUCING SAME MARUZEN PETROCHEMICAL CO., LTD. (JP) 2014-09-25 US disclosed
US-20140287219-A1 OPTICAL ELEMENT MATERIAL AND METHOD FOR PRODUCING SAME MARUZEN PETROCHEMICAL CO., LTD. (JP) 2014-09-25 US disclosed
US-20130288021-A1 RESIN COMPOSITION FOR PHOTOIMPRINTING, PATTERN FORMING PROCESS AND ETCHING MASK MARUZEN PETROCHEMICAL CO., LTD. (JP) 2013-10-31 US disclosed
US-20130288021-A1 RESIN COMPOSITION FOR PHOTOIMPRINTING, PATTERN FORMING PROCESS AND ETCHING MASK MARUZEN PETROCHEMICAL CO., LTD. (JP) 2013-10-31 US disclosed
US-7361432-B2 Composition for hologram-recording material, hologram-recording medium, and process for producing the same NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 2008-04-22 US disclosed
US-20050185232-A1 Volume hologram recording photosensitive composition and its use NIPPON PAINT CO., LTD. (JP) 2005-08-25 US disclosed
US-20040096776-A1 Composition for hologram-recording material, hologram-recording medium, and process for producing the same Daiso, Co., Ltd. (JP) 2004-05-20 US disclosed
EP-1376268-A1 COMPOSITION FOR HOLOGRAM-RECORDING MATERIAL, HOLOGRAM-RECORDING MEDIUM, AND PROCESS FOR PRODUCING THE SAME National Institute of Advanced Industrial Science and Technology (JP) 2004-01-02 EP disclosed
US-20030096172-A1 Hologram recording material composition and hologram recording medium DAISO CO., LTD. (JP) 2003-05-22 US disclosed