SCHEMBL4955037

SCHEMBL4955037

O=C1C=CC(=O)N1C=C1CCC(=CN2C(=O)C=CC2=O)CC1

nearest known ligand 0.33

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 2/20 0.33
GSK3A P49840 1/20 0.33
GSK3B P49841 1/20 0.33
FAAH O00519 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11001975 0.81 MGLL (0.55) MGLLFAAH
SCHEMBL4955271 0.70 MGLL (0.38) MGLLGSK3AGSK3BFAAH
SCHEMBL28572221 0.67 MGLL (0.42) MGLLGSK3AGSK3BFAAH
SCHEMBL9407360 0.67 MGLL (0.42) MGLLGSK3AGSK3BFAAH
SCHEMBL1664700 0.63
SCHEMBL28379307 0.63
SCHEMBL9777831 0.63
SCHEMBL15577150 0.61 MGLL (0.38) MGLLGSK3AGSK3BFAAH
SCHEMBL16377382 0.59 MGLL (0.35) MGLLGSK3AGSK3BFAAH
SCHEMBL2359893 0.59 MGLL (0.35) MGLLGSK3AGSK3BFAAH

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6337375-B1 RESIN WITH COLOR AND FLUORESCING AGENT INTERNATIONAL BUSINESS MACHINES CORPORATION 2002-01-08 US claimed
US-6190759-B1 ELECTRONIC PACKAGE COMPRISING DIELECTRIC LAYER AND CONDUCTIVE LAYER, SAID DIELECTRIC LAYER INCLUDING REINFORCING MATERIAL, RESIN MATERIAL SELECTED FROM EPOXY, CYANATE AND BISMALEIMIDE RESINS, COLORING AGENT, AND FLUORESCING AGENT INTERNATIONAL BUSINESS MACHINES CORPORATION 2001-02-20 US claimed
US-6187417-B1 Substrate having high optical contrast and method of making same INTERNATIONAL BUSINESS MACHINES CORPORATION 2001-02-13 US claimed
US-4503186-A PRINTED CIRCUITS, SOLVENT-RESISTANT THERMOPLASTIC MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1985-03-05 US claimed
US-4404330-A ACRYLONITRILE-BUTADIENE COPOLYMER OR TERPOLYMER AND CYANATE ESTER COMPOUNDS MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-09-13 US claimed
US-4403073-A MODIFIED POLYBUTADIENE AND ISOCYANATE ESTER; HEAT RESISTANCE; FLEXIBILITY; ELASTICITY MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-09-06 US claimed
US-4396745-A POLYFUNCTIONAL AROMATIC CYANATE, RUBBER MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-08-02 US claimed
US-4396679-A Plastic articles suitable for electroless plating MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-08-02 US claimed
US-4383903-A POLYFUNCTIONAL AROMATIC CYANATE, ACRYLIC COMPOUND, POLYFUNCTIONAL MALEIMIDE, PHOTOINITIATOR MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-05-17 US claimed
US-20080200636-A1 Epoxy Resin, Hardenable Resin Composition Containing the Same and Use Thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2008-08-21 US disclosed
EP-1852451-A1 EPOXY RESIN, HARDENABLE RESIN COMPOSITION CONTAINING THE SAME AND USE THEREOF Nippon Kayaku Kabushiki Kaisha (JP) 2007-11-07 EP disclosed
US-6337375-B1 RESIN WITH COLOR AND FLUORESCING AGENT INTERNATIONAL BUSINESS MACHINES CORPORATION 2002-01-08 US disclosed
US-6190759-B1 ELECTRONIC PACKAGE COMPRISING DIELECTRIC LAYER AND CONDUCTIVE LAYER, SAID DIELECTRIC LAYER INCLUDING REINFORCING MATERIAL, RESIN MATERIAL SELECTED FROM EPOXY, CYANATE AND BISMALEIMIDE RESINS, COLORING AGENT, AND FLUORESCING AGENT INTERNATIONAL BUSINESS MACHINES CORPORATION 2001-02-20 US disclosed
US-6187417-B1 Substrate having high optical contrast and method of making same INTERNATIONAL BUSINESS MACHINES CORPORATION 2001-02-13 US disclosed
US-4740343-A Method for producing rigid resin molds MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1988-04-26 US disclosed
US-4717609-A CYANATE ESTER COMPOUND OR PREPOLYMER THEREOF; THERMOPLASTIC, SATURATED, AMORPHOUS POLYESTER RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1988-01-05 US disclosed
US-4645805-A HEAT, MOISTURE, CHEMICAL RESISTANCE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1987-02-24 US disclosed
US-4585855-A LIQUID, WORKABILITY MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1986-04-29 US disclosed
US-4503186-A PRINTED CIRCUITS, SOLVENT-RESISTANT THERMOPLASTIC MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1985-03-05 US disclosed
US-4496695-A POLYPHENYLENE ETHER RESIN AN EPOXY COMPOUND, PLUS A MALEIMIDE AND OR CYANATE ESTER COMPONENT MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1985-01-29 US disclosed