Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DPP4 | P27487 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7058113 | 0.89 | AKR1C3 (0.32) | — | |
| SCHEMBL8423577 | 0.88 | CHRM1 (0.36) | — | |
| SCHEMBL6427138 | 0.85 | CA2 (0.38) | — | |
| SCHEMBL3685443 | 0.84 | — | — | |
| SCHEMBL9189351 | 0.83 | MAPT (0.39) | — | |
| SCHEMBL8083660 | 0.81 | — | — | |
| SCHEMBL8083662 | 0.81 | — | — | |
| SCHEMBL158890 | 0.78 | AKR1C3 (0.31) | — | |
| SCHEMBL164963 | 0.76 | — | — | |
| SCHEMBL3659175 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2021014956-A1 | PHOTOSENSITIVE RESIN COMPOSITION | 日産化学株式会社 | 2021-01-28 | — | — | WO | disclosed |
| US-10816900-B2 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-10-27 | — | — | US | disclosed |
| WO-2020044918-A1 | NEGATIVE-WORKING PHOTOSENSITIVE RESIN COMPOSITION | 日産化学株式会社 | 2020-03-05 | — | — | WO | disclosed |
| US-10203601-B2 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-02-12 | — | — | US | disclosed |
| US-20190018320-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-01-17 | — | — | US | disclosed |
| US-20180120702-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-05-03 | — | — | US | disclosed |
| EP-3315504-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-05-02 | — | — | EP | disclosed |
| US-8865110-B2 | Method for producing graphite film and graphite film produced by the method | KANEKA CORPORATION (JP) | 2014-10-21 | — | — | US | disclosed |
| US-8585998-B2 | Method for producing graphite film, and graphite film produced by the method | KANEKA CORPORATION (JP) | 2013-11-19 | — | — | US | disclosed |
| CN-101414122-B | Photosensitive polyimide | ETERNAL CHEMICAL INDUSTRY CO LTD | 2011-09-14 | — | — | CN | disclosed |
| CN-101145486-B | Electrode forming composition and plasma display panel manufactured using the same | SAMSUNG SDI CO LTD | 2010-09-29 | — | — | CN | disclosed |
| CN-101656184-A | Plasma display panel | SAMSUNG SDI CO LTD KR | 2010-02-24 | — | — | CN | disclosed |
| CN-101492538-A | Photosensitive polyimide | ETERNAL CHEMICAL CO LTD (CN) | 2009-07-29 | — | — | CN | disclosed |
| CN-101487977-A | Photosensitive polyimide | ETERNAL CHEMICAL INDUSTRY CO LTD (CN) | 2009-07-22 | — | — | CN | disclosed |
| CN-101414122-A | Photosensitive polyimide | ETERNAL CHEMICAL INDUSTRY CO LTD (CN) | 2009-04-22 | — | — | CN | disclosed |
| CN-101145486-A | Electrode forming composition and plasma display panel manufactured using the same | SAMSUNG SDI CO LTD (KR) | 2008-03-19 | — | — | CN | disclosed |
| US-20080050305-A1 | Method for Producing Graphite Film, and Graphite Film Produced By the Method | KANEKA CORPORATION (JP) | 2008-02-28 | — | — | US | disclosed |
| US-7141614-B2 | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEKA CORPORATION (JP) | 2006-11-28 | — | — | US | disclosed |
| US-20040265731-A1 | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEKA CORPORATION (JP) | 2004-12-30 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20190018320-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | TET1, KDM2B, ARCN1 | DPP4 4746/4885 |
| US-10816900-B2 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | TET1, KDM2B, ARCN1 | DPP4 4746/4885 |
| US-20180120702-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | TET1, KDM1A, KDM2B | DPP4 4467/4885 |
| US-10203601-B2 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | TET1, KDM1A, KDM2B | DPP4 4467/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.