SCHEMBL497290

SCHEMBL497290

C=C(C)C(=O)OCC(CC)CC(CC)COC(=O)C(=C)C

nearest known ligand 0.59

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TSHR P16473 6/20 0.59
THRB P10828 1/20 0.46
ALDH1A1 P00352 6/20 0.39
CYP3A4 P08684 2/20 0.37
TDP1 Q9NUW8 2/20 0.37
ATM Q13315 1/20 0.37
CA2 P00918 1/20 0.33
LMNA P02545 2/20 0.31
MAPK1 P28482 1/20 0.31
POLB P06746 1/20 0.31
APEX1 P27695 1/20 0.31
HTT P42858 1/20 0.31
RECQL P46063 1/20 0.31
PRSS1 P07477 1/20 0.31
PRSS2 P07478 1/20 0.31
PRSS3 P35030 1/20 0.31
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2442706 0.93 TSHR (0.52) TSHRTHRBALDH1A1CYP3A4TDP1
SCHEMBL3974700 0.92 TSHR (0.63) TSHRTHRBALDH1A1CYP3A4TDP1
SCHEMBL75001 0.92 TSHR (0.63) TSHRTHRBALDH1A1CYP3A4TDP1
SCHEMBL23494101 0.91 TSHR (0.63) TSHRTHRBALDH1A1CYP3A4TDP1
SCHEMBL7778330 0.87 TSHR (0.46) TSHRTHRBALDH1A1CYP3A4TDP1
Methacrylic Acid SCHEMBL20574597 0.86 TSHR (0.57) TSHRTHRBALDH1A1CYP3A4TDP1
SCHEMBL481538 0.86 TSHR (0.57) TSHRTHRBALDH1A1CYP3A4TDP1
SCHEMBL7779126 0.86 TSHR (0.53) TSHRTHRBALDH1A1CYP3A4TDP1
SCHEMBL147268 0.85 TSHR (0.71) TSHRTHRBALDH1A1CYP3A4TDP1
SCHEMBL15381098 0.85 TSHR (0.55) TSHRTHRBALDH1A1CYP3A4TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 98 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250155808-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN ZEON CORPORATION (JP) 2025-05-15 US disclosed
WO-2024143072-A1 COMPOSITION AND CURED PRODUCT 株式会社ADEKA 2024-07-04 WO disclosed
WO-2024070672-A1 RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN 日本ゼオン株式会社 2024-04-04 WO disclosed
CN-116997856-A Method for manufacturing flexible printed board 株式会社钟化 2023-11-03 CN disclosed
CN-115918275-B Method for manufacturing flexible printed board 株式会社钟化 2023-10-27 CN disclosed
WO-2023189969-A1 RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN 日本ゼオン株式会社 2023-10-05 WO disclosed
EP-3932906-B1 NOVEL COMPOUND, COMPOSITION CONTAINING SAID COMPOUND, AND CURED OBJECT ADEKA CORP (JP) 2023-07-12 EP disclosed
US-11667609-B2 Compound, composition containing said compound, self-healing material, surface coating agent, paint, adhesive, material for battery and cured product ADEKA CORPORATION (JP) 2023-06-06 US disclosed
CN-113544120-B Novel compound, composition containing same, self-repairing material, surface coating agent, paint, adhesive, battery material, and cured product 株式会社ADEKA 2023-05-02 CN disclosed
CN-115918275-A Method for manufacturing flexible printed board 株式会社钟化 2023-04-04 CN disclosed
US-20080050305-A1 Method for Producing Graphite Film, and Graphite Film Produced By the Method KANEKA CORPORATION (JP) 2008-02-28 US disclosed
US-20070178313-A1 Aqueous primer composition, method of surface treating by using the same and laminated structure thereof DAINIPPON INK AND CHEMICALS, INC. (JP) 2007-08-02 US disclosed
EP-1788050-A1 AQUEOUS PRIMER COMPOSITION, SURFACE TREATING METHOD USING SAME, AND MULTILAYER STRUCTURE Dainippon Ink and Chemicals, Incorporated (JP) 2007-05-23 EP disclosed
US-20060199920-A1 Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof KANEKA CORPORATION (JP) 2006-09-07 US disclosed
US-20060142542-A1 Phosphazene compound, photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2006-06-29 US disclosed
US-20040235992-A1 Photosensitive resin composition and photosensitive dry film resist and photosensitive coverlay film produced therefrom KANEKA CORPORATION (JP) 2004-11-25 US disclosed
US-6605353-B2 Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming KANEKA CORPORATION (JP) 2003-08-12 US disclosed
US-20010056174-A1 Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide KANEKA CORPORATION (JP) 2001-12-27 US disclosed
EP-0909752-B1 DI(METH)ACRYLATES KYOWA YUKA KK (JP) 2001-09-05 EP disclosed
EP-0909752-A1 DI(METH)ACRYLATES Kyowa Yuka Co., Ltd. (JP) 1999-04-21 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11667609-B2 Compound, composition containing said compound, self-healing material, surface coating agent, paint, adhesive, material for battery and cured product H1-0, H1-10, RAD51 TSHR 4534/4885THRB 3173/4885ALDH1A1 323/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.