SCHEMBL497382

SCHEMBL497382

CCC(C)(C)CCC[O]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL497731 0.81
SCHEMBL27160388 0.81 TDP1 (0.40)
SCHEMBL12985931 0.80 ALDH1A1 (0.32)
SCHEMBL1836223 0.78 TDP1 (0.43)
SCHEMBL7863984 0.78 TDP1 (0.43)
SCHEMBL1834842 0.78 TDP1 (0.43)
SCHEMBL55858 0.75
SCHEMBL20609970 0.73 TSHR (0.46)
SCHEMBL18799382 0.73 TSHR (0.41)
SCHEMBL598125 0.73 TSHR (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 87 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4372019-A1 NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME, AND MOLDED BODY THEREOF Nippon Soda Co., Ltd. (JP) 2024-05-22 EP disclosed
US-11834390-B2 Adhesive composition NIPPON SODA CO., LTD. (JP) 2023-12-05 US disclosed
WO-2023190374-A1 DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREFROM 日本曹達株式会社 2023-10-05 WO disclosed
US-20230118487-A1 TWO-COMPONENT ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2023-04-20 US disclosed
US-20230120998-A1 ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2023-04-20 US disclosed
EP-4130179-A1 TWO-COMPONENT ADHESIVE COMPOSITION Nippon Soda Co., Ltd. (JP) 2023-02-08 EP disclosed
EP-4130166-A1 ADHESIVE COMPOSITION Nippon Soda Co., Ltd. (JP) 2023-02-08 EP disclosed
WO-2023286714-A1 NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME, AND MOLDED BODY THEREOF 日本曹達株式会社 2023-01-19 WO disclosed
US-20210347726-A1 ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2021-11-11 US disclosed
EP-3862407-A1 ADHESIVE COMPOSITION Nippon Soda Co., Ltd. (JP) 2021-08-11 EP disclosed
US-6106999-A SENSITIVITY TO GENERAL-PURPOSE VISIBLE LIGHT LASER, SO THAT HIGH-SPEED SCANNING EXPOSURE IS POSSIBLE BY LASER, AND EXTREMELY FINE HIGH RESOLUTION CAN BE OBTAINED; CAN BE USED FOR COATING OR PRINTING UNDER SAFELIGHT IRRADIATING CONDITIONS MITSUI CHEMICALS (JP) 2000-08-22 US disclosed
US-6048587-A POLYBUTADIEBE BACKBONE HAVING ACRYLATE OR VINYL ETHER SUBSTITUENTS AND AN IONICALLY BONDED NEUTRALIZING AGENT SUCH AS AN AMINOACRYLATE, RESISTANT TO MOST SOLVENTS, RICON RESINS, INC. (US) 2000-04-11 US disclosed
EP-0963972-A2 Stereoselective reduction of carbonyl compounds F. HOFFMANN-LA ROCHE AG (CH) 1999-12-15 EP disclosed
CN-1238327-A Stereoselective reduction of carbonyl compounds HOFFMANN LA ROCHE (CH) 1999-12-15 CN disclosed
US-5990172-A Peptidomimetics for the treatment of HIV infection INNAPHARMA, INC. (US) 1999-11-23 US disclosed
WO-1997031628-A1 PEPTIDOMIMETICS FOR THE TREATMENT OF HIV INFECTION INNAPHARMA, INC. (US) 1997-09-04 WO disclosed
EP-0504812-B1 Aromatic compounds, their production processes and their compositions for the control of insect pests SUMITOMO CHEMICAL CO (JP) 1995-09-06 EP disclosed
US-5302619-A Aromatic compounds, their production processes and their compositions for the control of insect pests SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-04-12 US disclosed
US-5262441-A APPLYING INSECTICIDE TO INSECT OR LOCUS WHERE INSECT PROPAGATES SUMITOMO CHEMICAL COMPANY LIMITED (JP) 1993-11-16 US disclosed
EP-0504812-A2 Aromatic compounds, their production processes and their compositions for the control of insect pests SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1992-09-23 EP disclosed