SCHEMBL498532

SCHEMBL498532

CCC(=CO)c1ccccc1

nearest known ligand 0.52

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ATM Q13315 1/20 0.52
CES2 O00748 2/20 0.45
CES1 P23141 2/20 0.45
ESR1 P03372 3/20 0.41
ESR2 Q92731 2/20 0.41
HDAC1 Q13547 2/20 0.41
HDAC2 Q92769 2/20 0.41
HDAC3 O15379 1/20 0.41
NCOR2 Q9Y618 1/20 0.41
MAOA P21397 2/20 0.39
MAOB P27338 2/20 0.39
CYP19A1 P11511 1/20 0.39
MTNR1A P48039 2/20 0.38
MTNR1B P49286 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL515423 0.83 ATM (0.48) ATMCES2CES1ESR1ESR2
SCHEMBL6027480 0.83 ATM (0.48) ATMCES2CES1ESR1ESR2
SCHEMBL515424 0.83 ATM (0.48) ATMCES2CES1ESR1ESR2
SCHEMBL8059220 0.80 ATM (0.42) ATMCES2CES1ESR1ESR2
SCHEMBL17188465 0.79 ATM (0.45) ATMCES2CES1ESR1ESR2
SCHEMBL16787362 0.79 ATM (0.45) ATMCES2CES1ESR1ESR2
SCHEMBL3962527 0.79 ATM (0.45) ATMCES2CES1ESR1ESR2
SCHEMBL17188467 0.79 MAOA (0.57) ATMCES2CES1ESR1ESR2
SCHEMBL22567026 0.79 ATM (0.45) ATMCES2CES1ESR1ESR2
SCHEMBL2806416 0.79 ATM (0.45) ATMCES2CES1ESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 223 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122070516-A Negative photosensitive composition, photosensitive resist film, method for producing hollow structure, and method for forming pattern 东京应化工业株式会社 2026-05-19 CN disclosed
CN-120065622-A Photosensitive resin composition and method for producing microlens 东京应化工业株式会社 2025-05-30 CN disclosed
CN-119977851-A Sulfonyl imide salt photoacid generator and application thereof in photoresist 杭州先研科技有限公司 2025-05-13 CN disclosed
CN-119620544-A Photosensitive resin composition, dry film, photosensitive dry film, resist film, molded substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2025-03-14 CN disclosed
CN-114503030-B Negative photosensitive resin composition, photosensitive resist film, pattern forming method, cured film, manufacturing method, and roll 东京应化工业株式会社 2025-03-11 CN disclosed
CN-119511633-A Photosensitive resin composition and preparation method and application thereof 广东聚石科技研究院有限公司 2025-02-25 CN disclosed
CN-110317174-B Hydrogen barrier agent, composition for forming hydrogen barrier film, method for producing hydrogen barrier film, and electronic device 东京应化工业株式会社 2024-10-22 CN disclosed
CN-118829948-A Method for manufacturing plating shaped article 东京应化工业株式会社 2024-10-22 CN disclosed
CN-118742854-A Chemically amplified positive photosensitive composition, method for producing molded substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2024-10-01 CN disclosed
CN-118642327-A Chemically amplified positive photosensitive composition, method for producing molded substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2024-09-13 CN disclosed
US-5246507-A Hydroxystyrene polymer and metal ion KAO CORPORATION (JP) 1993-09-21 US disclosed
US-5188866-A Recording coating of ferromagnetic metal and polymer; corrosion resistance KAO CORPORATION (JP) 1993-02-23 US disclosed
US-5158708-A Binder of polyhydroxystyrene derivative and thermosetting resins KAO CORPORATION (JP) 1992-10-27 US disclosed
US-5156771-A Comprising a metal powder, a binder of a homo- or copolymer of a substituted hydroxystyrene and a solvent; printed circuits; noise shield; durability; adhesion KAO CORPORATION (JP) 1992-10-20 US disclosed
US-5080982-A Magnetic recording medium KAO CORPORATION (JP) 1992-01-14 US disclosed
EP-0430277-A1 Conductive paste and conductive coating film Kao Corporation (JP) 1991-06-05 EP disclosed
US-4978399-A Plating or painting pretreatment with an ionized metal compound and a hydroxystyrenesulfonate polymer; coroosion resistance; adhesion KAO CORPORATION (JP) 1990-12-18 US disclosed
EP-0400642-A2 Electrically conductive paste composition KAO CORPORATION (JP) 1990-12-05 EP disclosed
EP-0304377-A2 Polymers derived from polystyrenes and cross-linked dextranes, their preparation and their use in the analysis and the purification of biologic molecules THERAPEUTIQUES SUBSTITUTIVES Groupement d'Intérêt Public (FR) 1989-02-22 EP disclosed
EP-0153692-A2 Method for isomerization a glycidate derivative SAGAMI CHEMICAL RESEARCH CENTER (JP) 1985-09-04 EP disclosed