Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PARL | Q9H300 | 3/20 | 0.46 |
| ▸ | CA12 | O43570 | 1/20 | 0.31 |
| ▸ | CA1 | P00915 | 1/20 | 0.31 |
| ▸ | CA2 | P00918 | 1/20 | 0.31 |
| ▸ | CA9 | Q16790 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3087267 | 0.78 | PARL (0.50) | PARLCA2 | |
| SCHEMBL64814 | 0.78 | PARL (0.50) | PARLCA2 | |
| SCHEMBL12889904 | 0.75 | PARL (0.43) | PARL | |
| SCHEMBL4834969 | 0.74 | — | — | |
| SCHEMBL28411329 | 0.74 | PARL (0.54) | PARLCA12CA1CA2CA9 | |
| SCHEMBL4831968 | 0.74 | — | — | |
| SCHEMBL14983968 | 0.71 | PARL (0.40) | PARL | |
| SCHEMBL215806 | 0.71 | PARL (0.40) | PARLCA1CA2 | |
| SCHEMBL14321874 | 0.71 | PARL (0.40) | PARL | |
| SCHEMBL16883338 | 0.71 | PARL (0.43) | PARL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 168 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4667537-A1 | PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-12-24 | — | — | EP | disclosed |
| US-20250382500-A1 | PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE | TOKYO OHKA KOGYO CO LTD (JP) | 2025-12-18 | — | — | US | disclosed |
| US-20250271751-A1 | PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, LOWER LAYER FILM, METHOD FOR PRODUCING STRUCTURE HAVING PHASE-SEPARATED STRUCTURE, AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-08-28 | — | — | US | disclosed |
| US-20250189895-A1 | METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-06-12 | — | — | US | disclosed |
| CN-120065622-A | Photosensitive resin composition and method for producing microlens | 东京应化工业株式会社 | 2025-05-30 | — | — | CN | disclosed |
| US-20250172872-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-05-29 | — | — | US | disclosed |
| CN-119620544-A | Photosensitive resin composition, dry film, photosensitive dry film, resist film, molded substrate with mold, and method for producing plated molded article | 东京应化工业株式会社 | 2025-03-14 | — | — | CN | disclosed |
| EP-3961676-B1 | ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2025-01-22 | — | — | EP | disclosed |
| CN-110317174-B | Hydrogen barrier agent, composition for forming hydrogen barrier film, method for producing hydrogen barrier film, and electronic device | 东京应化工业株式会社 | 2024-10-22 | — | — | CN | disclosed |
| CN-118829948-A | Method for manufacturing plating shaped article | 东京应化工业株式会社 | 2024-10-22 | — | — | CN | disclosed |
| US-20060141387-A1 | Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-29 | — | — | US | disclosed |
| US-7063934-B2 | Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same | TOYKO OHKA KOGYO CO., LTD. (JP) | 2006-06-20 | — | — | US | disclosed |
| WO-2006059757-A2 | PROCESS FOR PRODUCING RESIST PATTERN AND CONDUCTOR PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-08 | — | — | WO | disclosed |
| WO-2006059747-A1 | PROCESS FOR PRODUCING RESIST PATTERN AND CONDUCTOR PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-08 | — | — | WO | disclosed |
| US-20060035170-A1 | Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same | SAITO KOJI | 2006-02-16 | — | — | US | disclosed |
| US-20060035169-A1 | Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. | 2006-02-16 | — | — | US | disclosed |
| WO-2006003757-A1 | METHOD OF FORMING PLATED PRODUCT USING NEGATIVE PHOTORESIST COMPOSITION AND PHOTOSENSITIVE COMPOSITION USED THEREIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-01-12 | — | — | WO | disclosed |
| US-6838229-B2 | Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-01-04 | — | — | US | disclosed |
| US-20030064319-A1 | Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. | 2003-04-03 | — | — | US | disclosed |
| US-20030039921-A1 | Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. | 2003-02-27 | — | — | US | disclosed |