SCHEMBL64814

SCHEMBL64814

O=C1CCC(=O)N1OS(=O)(=O)C(F)(F)F

nearest known ligand 0.50

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
PARL Q9H300 4/20 0.50
MMP2 P08253 2/20 0.33
ALOX12 P18054 1/20 0.30
CA2 P00918 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3087267 1.00 PARL (0.50) PARLMMP2ALOX12CA2
SCHEMBL16883338 0.92 PARL (0.43) PARLMMP2
SCHEMBL12889904 0.83 PARL (0.43) PARLMMP2
SCHEMBL14983968 0.79 PARL (0.40) PARL
SCHEMBL215806 0.79 PARL (0.40) PARLMMP2CA2
SCHEMBL14321874 0.79 PARL (0.40) PARL
SCHEMBL499047 0.78 PARL (0.46) PARLCA2
SCHEMBL503740 0.77 CA2 (0.39) PARLMMP2CA2
SCHEMBL3853587 0.76 KDM4E (0.30) PARL
SCHEMBL18730404 0.75 PARL (0.43) PARL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 4209 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-121873631-B Spin-on carbon composition, semiconductor preparation method and semiconductor device Jiageng Innovation Laboratory (CN) 2026-05-26 CN claimed
CN-122011922-A Bottom anti-reflection coating composition and preparation and application thereof 嘉庚创新实验室 2026-05-12 CN claimed
US-20250021002-A1 BOTTOM ANTI-REFLECTIVE COATING FOR DEEP ULTRAVIOLET LITHOGRAPHY, PREPARATION METHOD THEREFOR AND USE THEREOF CHINA ADVANCED LITHOGRAPHIC MATERIAL TECHNOLOGY CO. LTD. (CN) 2025-01-16 US claimed
CN-115368494-B Monomer copolymer containing hexafluoroisopropanol, preparation method thereof, chemical amplification type photoresist and application thereof 瑞红(苏州)电子化学品股份有限公司 2024-03-29 CN claimed
CN-117608167-A Photoresist composition and method for producing photoresist pattern 南开大学 2024-02-27 CN claimed
CN-110832397-B Composition for forming resist underlayer film, and method for forming resist pattern 日产化学株式会社 2023-12-15 CN claimed
WO-2023082371-A1 BOTTOM ANTI-REFLECTIVE COATING FOR DEEP ULTRAVIOLET LITHOGRAPHY, PREPARATION METHOD THEREFOR AND USE THEREOF 上海新阳半导体材料股份有限公司 2023-05-19 WO claimed
CN-115873176-A Bottom anti-reflection coating for DUV lithography and preparation method and application thereof 上海新阳半导体材料股份有限公司 2023-03-31 CN claimed
CN-115873175-A Bottom anti-reflection coating for DUV lithography and preparation method and application thereof 上海新阳半导体材料股份有限公司 2023-03-31 CN claimed
CN-115685678-A Star-shaped molecular glass film forming resin and photoresist and preparation method thereof 南通林格橡塑制品有限公司 2023-02-03 CN claimed
US-20040253547-A1 Pattern formation method MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2004-12-16 US claimed
US-6569596-B1 Photoresists comprising N-(ethylsulfonyloxy)succinimide, novolaks, curing agents and an acid generators such as alpha -(hexylsulfonyloxyimino)-4-methoxybenzyl cyanide; integrated circuits; semiconductors SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-05-27 US claimed
US-6235446-B1 MIXTURE OF P-HYDROXYSTYRENE, ACRYLATED ESTER JSR CORPORATION (JP) 2001-05-22 US claimed
US-6114422-A Resist composition containing dialkyl malonate in base polymer SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-09-05 US claimed
EP-0745633-B1 Si containing high molecular compound and photosensitive resin composition NEC CORP (JP) 2000-08-02 EP claimed
US-5994022-A BECOMES SOLUBLE IN ALKALI DEVELOPING SOLUTION BY ACTION OF AN ACID JSR CORPORATION (JP) 1999-11-30 US claimed
US-5916728-A RESIN WHICH IS CONVERTED TO ALKALI-SOLUBLE FROM ALKALI-INSOLUBLE OR ALKALI-SLIGHTLY SOLUBLE BY THE ACTION OF AN ACID, ACID GENERATOR AND TERTIARY AMINE COMPOUND HAVING AN ALIPHATIC HYDROXYL GROUP. SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1999-06-29 US claimed
US-5723257-A POLYVINYLSILSESQUIOXANES OR OTHER POLYSILOXANES NEC CORPORATION (JP) 1998-03-03 US claimed
US-5621019-A PHOTORESIST CONTAINING PHOTO ACID GENERATOR AND ULTRAVIOLET RADIATION TRANSPARENT ACRYLIC POLYMER HAVING BRIDGED CYCLOHYDROCARBON GROUP RESIDUE; RESOLUTION, DRY ETCH RESISTANCE NEC CORPORATION (JP) 1997-04-15 US claimed
EP-0745633-A2 Si containing high molecular compound and photosensitive resin composition NEC CORPORATION (JP) 1996-12-04 EP claimed