Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BRAF | P15056 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL499062 | 1.00 | BRAF (0.31) | BRAF | |
| SCHEMBL17447742 | 0.96 | CYP1A2 (0.34) | — | |
| SCHEMBL17447743 | 0.96 | CYP1A2 (0.34) | — | |
| SCHEMBL499088 | 0.90 | CYP1A2 (0.36) | BRAF | |
| SCHEMBL499089 | 0.90 | CYP1A2 (0.36) | BRAF | |
| SCHEMBL5188267 | 0.87 | — | — | |
| SCHEMBL21933181 | 0.86 | AHR (0.38) | — | |
| SCHEMBL21933180 | 0.86 | AHR (0.38) | — | |
| SCHEMBL25422554 | 0.79 | BRAF (0.47) | BRAF | |
| SCHEMBL498611 | 0.79 | BRAF (0.47) | BRAF |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 159 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4667537-A1 | PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-12-24 | — | — | EP | disclosed |
| US-20250382500-A1 | PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE | TOKYO OHKA KOGYO CO LTD (JP) | 2025-12-18 | — | — | US | disclosed |
| US-20250271751-A1 | PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, LOWER LAYER FILM, METHOD FOR PRODUCING STRUCTURE HAVING PHASE-SEPARATED STRUCTURE, AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-08-28 | — | — | US | disclosed |
| US-20250189895-A1 | METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-06-12 | — | — | US | disclosed |
| US-20250172872-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-05-29 | — | — | US | disclosed |
| EP-3961676-B1 | ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2025-01-22 | — | — | EP | disclosed |
| US-20240053680-A1 | PHOTOSENSITIVE DRY FILM, LAMINATED FILM, METHOD FOR PRODUCING LAMINATED FILM, AND METHOD FOR PRODUCING PATTERNED RESIST FILM | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-15 | — | — | US | disclosed |
| US-11803122-B2 | Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-10-31 | — | — | US | disclosed |
| US-11754926-B2 | Method of forming resist pattern, resist composition and method of producing the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-09-12 | — | — | US | disclosed |
| WO-2023162552-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE COMPOSITION, PRODUCTION METHOD FOR SUBSTRATE WITH TEMPLATE, AND PRODUCTION METHOD FOR PLATED ARTICLE | 東京応化工業株式会社 | 2023-08-31 | — | — | WO | disclosed |
| WO-2006003757-A1 | METHOD OF FORMING PLATED PRODUCT USING NEGATIVE PHOTORESIST COMPOSITION AND PHOTOSENSITIVE COMPOSITION USED THEREIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-01-12 | — | — | WO | disclosed |
| US-20060003260-A1 | Chemical amplified positive photo resist composition and method for forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-01-05 | — | — | US | disclosed |
| US-20050244740-A1 | Chemically amplified positive photo resist composition and method for forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-11-03 | — | — | US | disclosed |
| US-20050236967-A1 | Resist composition for separator formation, separator of EL display device and EL display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-10-27 | — | — | US | disclosed |
| US-20050130055-A1 | Method and removing resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-06-16 | — | — | US | disclosed |
| WO-2005026836-A2 | LAMINATED PHOTOSENSITIVE RELIEF PRINTING ORIGINAL PLATE AND METHOD FOR PRODUCING THE RELIEF PRINTING PLATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-03-24 | — | — | WO | disclosed |
| US-6838229-B2 | Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-01-04 | — | — | US | disclosed |
| US-20030064319-A1 | Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. | 2003-04-03 | — | — | US | disclosed |
| US-20030039921-A1 | Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. | 2003-02-27 | — | — | US | disclosed |
| US-5368783-A | Novolak resin or polyhydroxystyrene resin, alkoxymethylated amino resin and triazine | TOKYO OHKA KOGYO CO., LTD. (JP) | 1994-11-29 | — | — | US | disclosed |