SCHEMBL5029090

SCHEMBL5029090

C1=CC(CC2CO2)(CC2CO2)C=CC1OC1C=CC(CC2CO2)(CC2CO2)C=C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1036901 0.56
SCHEMBL25363579 0.54 CHRM2 (0.34)
SCHEMBL31556139 0.53 ALDH1A1 (0.35)
SCHEMBL8766147 0.53 ALDH1A1 (0.35)
SCHEMBL9443187 0.52 TSHR (0.30)
SCHEMBL7680914 0.52
SCHEMBL6048412 0.52
SCHEMBL31413607 0.52 ALDH1A1 (0.33)
SCHEMBL4300995 0.52 ALDH1A1 (0.33)
SCHEMBL13292022 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1502155-B1 RADIATION CURABLE RESIN COMPOSITION AND RAPID PROTOTYPING PROCESS USING THE SAME DSM IP ASSETS BV (NL) 2013-01-30 EP disclosed
EP-2466378-A2 Radiation curable resin composition and rapid prototyping process using the same DSM IP Assets B.V. (NL) 2012-06-20 EP disclosed
US-20080064780-A1 Radiation curable resin composition and rapid prototyping process using the same DSM IP ASSETS B.V. (NL) 2008-03-13 US disclosed
US-20070154840-A1 Radiation curable resin composition and rapid prototyping process using the same DSM IP ASSETS B.V. (NL) 2007-07-05 US disclosed
US-7183040-B2 Radiation curable resin composition and rapid prototyping process using the same DSM IP ASSETS B.V. (NL) 2007-02-27 US disclosed
EP-1502155-A1 RADIATION CURABLE RESIN COMPOSITION AND RAPID PROTOTYPING PROCESS USING THE SAME DSM IP Assets B.V. (NL) 2005-02-02 EP disclosed
US-20040142274-A1 Radiation curable resin composition and rapid prototyping process using the same STRATASYS INC. 2004-07-22 US disclosed
WO-2003093901-A1 RADIATION CURABLE RESIN COMPOSITION AND RAPID PROTOTYPING PROCESS USING THE SAME DSM IP ASSETS B.V. (NL) 2003-11-13 WO disclosed
US-6632523-B1 Polyimidesiloxane made from a dianhydride, an aromatic diamine and a siloxanediamine, an epoxy resin, and a cyanate; tape SUMITOMO BAKELITE COMPANY LIMITED (JP) 2003-10-14 US disclosed
WO-2002026888-A2 LOW TEMPERATURE BONDING ADHESIVE COMPOSITION SUMITOMO BAKELITE COMPANY LIMITED (JP) 2002-04-04 WO disclosed
US-4117361-A LIQUID DIEPOXIDE AND DIGLYCIDYL ETHER OF A GLYCOL, TITANATE CURING CATALYST WESTINGHOUSE ELECTRIC CORP. (US) 1978-09-26 US disclosed