Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 2/20 | 0.62 |
| ▸ | TSHR | P16473 | 1/20 | 0.62 |
| ▸ | PLA2G4B | P0C869 | 5/20 | 0.60 |
| ▸ | NR5A1 | Q13285 | 1/20 | 0.59 |
| ▸ | RARB | P10826 | 3/20 | 0.57 |
| ▸ | GAA | P10253 | 3/20 | 0.57 |
| ▸ | RAB9A | P51151 | 2/20 | 0.57 |
| ▸ | NPC1 | O15118 | 1/20 | 0.57 |
| ▸ | LMNA | P02545 | 1/20 | 0.57 |
| ▸ | MAPT | P10636 | 1/20 | 0.57 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.57 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.57 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.56 |
| ▸ | LTA4H | P09960 | 2/20 | 0.56 |
| ▸ | PLA2G4A | P47712 | 1/20 | 0.54 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5502709 | 0.98 | TP53 (0.65) | TP53TSHRPLA2G4BNR5A1RARB | |
| SCHEMBL3001656 | 0.98 | TP53 (0.65) | TP53TSHRPLA2G4BNR5A1RARB | |
| SCHEMBL3001402 | 0.98 | TP53 (0.65) | TP53TSHRPLA2G4BNR5A1RARB | |
| SCHEMBL5033226 | 0.96 | GAA (0.56) | TP53TSHRPLA2G4BNR5A1RARB | |
| SCHEMBL17253328 | 0.95 | RARB (0.65) | TP53TSHRPLA2G4BNR5A1RARB | |
| SCHEMBL12243089 | 0.95 | RARB (0.65) | TP53TSHRPLA2G4BNR5A1RARB | |
| SCHEMBL12243087 | 0.93 | RARB (0.68) | TP53TSHRPLA2G4BNR5A1RARB | |
| SCHEMBL12243086 | 0.93 | RARB (0.68) | TP53TSHRPLA2G4BNR5A1RARB | |
| SCHEMBL9781935 | 0.89 | L3MBTL1 (0.56) | TP53TSHRPLA2G4BGAARAB9A | |
| SCHEMBL24376085 | 0.88 | RARB (0.61) | TP53TSHRPLA2G4BNR5A1RARB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12024590-B2 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2024-07-02 | — | — | US | disclosed |
| US-12022611-B2 | Prepreg, metal-clad laminate, and wiring board | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2024-06-25 | — | — | US | disclosed |
| US-11958951-B2 | Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2024-04-16 | — | — | US | disclosed |
| US-20240067810-A1 | FLEXIBLE METAL CLAD LAMINATES AND METHODS OF PREPARATION THEREOF | Kraton Corporation (US) | 2024-02-29 | — | — | US | disclosed |
| US-20240002564-A1 | COPOLYMERS OF DIISOALKENYLARENE AND COMPOSITIONS THEREOF | Kraton Corporation (US) | 2024-01-04 | — | — | US | disclosed |
| US-20230094806-A1 | METAL-CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND RESIN COMPOSITION | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2023-03-30 | — | — | US | disclosed |
| US-20230054257-A1 | COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2023-02-23 | — | — | US | disclosed |
| US-20220275122-A1 | RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2022-09-01 | — | — | US | disclosed |
| US-20220220272-A1 | COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| CN-114555360-A | Copper-clad laminate, wiring board, and resin-attached copper foil | 松下知识产权经营株式会社 | 2022-05-27 | — | — | CN | disclosed |
| WO-2021079817-A1 | METAL CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND RESIN COMPOSITION | パナソニックＩＰマネジメント株式会社 | 2021-04-29 | — | — | WO | disclosed |
| WO-2021079819-A1 | COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN | パナソニックＩＰマネジメント株式会社 | 2021-04-29 | — | — | WO | disclosed |
| WO-2021060178-A1 | RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2021-04-01 | — | — | WO | disclosed |
| CN-112368311-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2021-02-12 | — | — | CN | disclosed |
| WO-2021024923-A1 | RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2021-02-11 | — | — | WO | disclosed |
| CN-112020523-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2020-12-01 | — | — | CN | disclosed |
| WO-2020230870-A1 | COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL | パナソニックＩＰマネジメント株式会社 | 2020-11-19 | — | — | WO | disclosed |
| WO-2020196759-A1 | PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2020-10-01 | — | — | WO | disclosed |
| US-7402645-B2 | Soluble polyfunctional vinyl aromatic polymer and method of producing the same | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2008-07-22 | — | — | US | disclosed |
| US-20070155923-A1 | Soluble polyfunctional vinyl aromatic polymer and method of producing the same | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2007-07-05 | — | — | US | disclosed |