Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.50 |
| ▸ | DHFR | P00374 | 1/20 | 0.50 |
| ▸ | NPC1 | O15118 | 2/20 | 0.48 |
| ▸ | RAB9A | P51151 | 2/20 | 0.48 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.45 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.45 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.44 |
| ▸ | MGLL | Q99685 | 2/20 | 0.44 |
| ▸ | BCHE | P06276 | 3/20 | 0.43 |
| ▸ | LMNA | P02545 | 1/20 | 0.42 |
| ▸ | TSHR | P16473 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15164276 | 0.94 | TDP1 (0.56) | TDP1DHFRNPC1RAB9AMAPK1 | |
| SCHEMBL5038684 | 0.90 | TDP1 (0.51) | TDP1DHFRNPC1RAB9AMAPK1 | |
| Ether SCHEMBL10965740 | 0.86 | DHFR (0.48) | TDP1DHFRNPC1RAB9AMAPK1 | |
| SCHEMBL121520 | 0.85 | DHFR (0.59) | TDP1DHFRMAPK1L3MBTL1MGLL | |
| SCHEMBL21801767 | 0.85 | DHFR (0.59) | TDP1DHFRMAPK1L3MBTL1MGLL | |
| SCHEMBL29374975 | 0.85 | DHFR (0.59) | TDP1DHFRMAPK1L3MBTL1MGLL | |
| SCHEMBL1537792 | 0.80 | DHFR (0.55) | DHFRMAPK1L3MBTL1MGLL | |
| SCHEMBL1715091 | 0.80 | DHFR (0.55) | DHFRNPC1RAB9AMAPK1L3MBTL1 | |
| SCHEMBL28387457 | 0.80 | DHFR (0.55) | TDP1DHFRMAPK1L3MBTL1MGLL | |
| SCHEMBL31377458 | 0.79 | DHFR (0.52) | TDP1DHFRMAPK1L3MBTL1MGLL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20080268257-A1 | MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYMIDE FILM, FILM FOR TAB, AND PREPREG | SEKISUI CHEMICAL CO., LTD. (JP) | 2008-10-30 | — | — | US | disclosed |
| US-20080268237-A1 | MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYIMIDE FILM FOR TAB, AND PREPREG | SEKISUI CHEMICAL CO., LTD. (JP) | 2008-10-30 | — | — | US | disclosed |
| US-20040053061-A1 | Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polymidefilm, film for tab, and prepreg | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-03-18 | — | — | US | disclosed |
| EP-1350815-A1 | MATERIAL FOR INSULATING SUBSTRATE, PRINTED BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYIMIDE FILM, FILM FOR TAB, AND PREPREG | SEKISUI CHEMICAL CO., LTD. (JP) | 2003-10-08 | — | — | EP | disclosed |