⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL128996 | 0.82 | KMT2A (0.30) | — | |
| Acrylic Acid SCHEMBL8676130 | 0.78 | — | — | |
| SCHEMBL6826957 | 0.77 | HDAC3 (0.32) | — | |
| SCHEMBL28857093 | 0.76 | — | — | |
| SCHEMBL57575 | 0.73 | GSTP1 (0.32) | — | |
| Methacrylic Acid SCHEMBL1454554 | 0.73 | — | — | |
| SCHEMBL6826819 | 0.72 | ALDH1A1 (0.32) | — | |
| SCHEMBL17292666 | 0.72 | HDAC3 (0.32) | — | |
| SCHEMBL5070953 | 0.71 | HCAR2 (0.33) | — | |
| SCHEMBL5072057 | 0.71 | HCAR2 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230104391-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2023-04-06 | — | — | US | disclosed |
| WO-2022239232-A1 | METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-11-17 | — | — | WO | disclosed |
| US-20080081873-A1 | Thermoplastic Elastomer Composition And Method For Producing Same | JSR CORPORATION (JP) | 2008-04-03 | — | — | US | disclosed |
| EP-1816163-A1 | THERMOPLASTIC ELASTOMER COMPOSITION AND METHOD FOR PRODUCING SAME | JSR Corporation (JP) | 2007-08-08 | — | — | EP | disclosed |
| EP-1302507-B1 | Thermoplastic elastomer composition, moldings using the same | JSR CORP (JP) | 2006-12-27 | — | — | EP | disclosed |
| US-6815506-B2 | DYNAMICALLY CROSSLINKED MIXTURE OF OLEFIN RESIN; UNSATURATED ACRYLIC RUBBER FROM DIUNSATURATED MONOMER, ALKYL OR ALKOXYALKYL ACRYLATE, AND ACRYLONITRILE; AND INORGANIC FILLER | JSR CORPORATION (JP) | 2004-11-09 | — | — | US | disclosed |
| US-20030096071-A1 | Oil-resistant thermoplastic elastomer composition and moldings using the same | JSR CORPORATION (JP) | 2003-05-22 | — | — | US | disclosed |
| EP-1302507-A2 | Thermoplastic elastomer composition, moldings using the same | JSR Corporation (JP) | 2003-04-16 | — | — | EP | disclosed |