Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 16/20 | 0.77 |
| ▸ | FAAH | O00519 | 5/20 | 0.58 |
| ▸ | HSP90AA1 | P07900 | 5/20 | 0.53 |
| ▸ | PKM | P14618 | 2/20 | 0.53 |
| ▸ | CCR6 | P51684 | 2/20 | 0.53 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.53 |
| ▸ | HPGD | P15428 | 2/20 | 0.53 |
| ▸ | HTT | P42858 | 2/20 | 0.53 |
| ▸ | MEN1 | O00255 | 1/20 | 0.53 |
| ▸ | LMNA | P02545 | 1/20 | 0.53 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.53 |
| ▸ | ATM | Q13315 | 1/20 | 0.53 |
| ▸ | F2 | P00734 | 1/20 | 0.52 |
| ▸ | ELANE | P08246 | 1/20 | 0.52 |
| ▸ | CTSG | P08311 | 1/20 | 0.52 |
| ▸ | CMA1 | P23946 | 1/20 | 0.52 |
| ▸ | CTRC | Q99895 | 1/20 | 0.52 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.48 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.48 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL331752 | 0.90 | MGLL (0.84) | MGLLFAAHHSP90AA1PKMCCR6 | |
| SCHEMBL4385482 | 0.90 | MGLL (0.84) | MGLLFAAHHSP90AA1PKMCCR6 | |
| SCHEMBL487033 | 0.90 | MGLL (0.84) | MGLLFAAHHSP90AA1PKMCCR6 | |
| SCHEMBL24753819 | 0.89 | MGLL (0.61) | MGLLFAAHHSP90AA1PKMCCR6 | |
| SCHEMBL140025 | 0.88 | MGLL (1.00) | MGLLFAAHHSP90AA1PKMCCR6 | |
| SCHEMBL31179991 | 0.87 | MGLL (0.64) | MGLLFAAHHSP90AA1PKMCCR6 | |
| SCHEMBL28454152 | 0.85 | MGLL (0.89) | MGLLFAAHHSP90AA1PKMCCR6 | |
| SCHEMBL5069390 | 0.84 | MGLL (0.63) | MGLLFAAHHSP90AA1PKMCCR6 | |
| SCHEMBL9245833 | 0.84 | MGLL (0.75) | MGLLFAAHHSP90AA1PKMCCR6 | |
| SCHEMBL3675014 | 0.82 | MGLL (1.00) | MGLLFAAHHSP90AA1PKMCCR6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0449292-B1 | Multilayer printed circuit board and production thereof | HITACHI LTD (JP) | 1997-08-20 | — | — | EP | claimed |
| CN-118251445-A | Cyclic organosiloxane containing imide bond and polymerizable unsaturated bond and curable resin composition containing the same | 信越化学工业株式会社 | 2024-06-25 | — | — | CN | disclosed |
| CN-118139742-A | Resin-coated metal foil, printed wiring board, method for manufacturing the same, and semiconductor package | 株式会社力森诺科 | 2024-06-04 | — | — | CN | disclosed |
| CN-118104403-A | Curable adhesive composition, film-like adhesive, method for producing multilayer wiring board, and multilayer wiring board | 株式会社力森诺科 | 2024-05-28 | — | — | CN | disclosed |
| CN-117980415-A | Thermosetting resin composition and thermosetting article | 宝理塑料赢创有限公司 | 2024-05-03 | — | — | CN | disclosed |
| CN-117882007-A | Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board | 株式会社力森诺科 | 2024-04-12 | — | — | CN | disclosed |
| CN-117881738-A | Resin composition, prepreg, laminated board, resin film, printed circuit board, and semiconductor package | 株式会社力森诺科 | 2024-04-12 | — | — | CN | disclosed |
| CN-112313281-B | Thermosetting resin composition, prepreg, laminated board, printed wiring board, semiconductor package, and method for producing thermosetting resin composition | 株式会社力森诺科 | 2024-03-29 | — | — | CN | disclosed |
| CN-117561309-A | Resin composition, resin film, printed circuit board, and semiconductor package | 株式会社力森诺科 | 2024-02-13 | — | — | CN | disclosed |
| CN-112585004-B | Copper foil processing method, copper foil, laminate, copper-clad laminate, printed wiring board, and high-speed communication module | 株式会社力森诺科 | 2023-11-03 | — | — | CN | disclosed |
| CN-103626959-A | Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same | HITACHI CHEMICAL CO LTD | 2014-03-12 | — | — | CN | disclosed |
| CN-102344816-B | Liquid crystal alignment agent, liquid crystal alignment film prepared from same and liquid crystal display element | CHI MEI CORP | 2014-02-19 | — | — | CN | disclosed |
| CN-102365310-B | Thermosetting resin composition, and prepreg, insulating film with support, laminate, and printed wiring board using same | HITACHI CHEMICAL CO LTD | 2013-11-20 | — | — | CN | disclosed |
| CN-102365310-A | Thermosetting resin composition, and prepreg, insulating film with support, laminate, and printed wiring board using same | HITACHI CHEMICAL CO LTD | 2012-02-29 | — | — | CN | disclosed |
| WO-2008099904-A1 | SILANE COMPOUND, PRODUCTION METHOD THEREOF, AND RESIN COMPOSITION CONTAINING SILANE COMPOUND | NIPPON SHOKUBAI CO., LTD. (JP) | 2008-08-21 | — | — | WO | disclosed |
| CN-1317329-C | Resin composition, prepreg and laminate using the composition | MITSUI CHEMICALS INC (JP) | 2007-05-23 | — | — | CN | disclosed |
| CN-1626577-A | Resin composition, prepreg and laminate using the composition | MITSUI CHEMICALS INC (JP) | 2005-06-15 | — | — | CN | disclosed |
| EP-0471522-B1 | Resin composition based on polymaleimide and phenolic aralkyl resin | MITSUI TOATSU CHEMICALS (JP) | 1995-12-13 | — | — | EP | disclosed |
| US-5266654-A | Polymaleimide, phenolic resin with xylylene groups, epoxy resin | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1993-11-30 | — | — | US | disclosed |
| EP-0471522-A1 | Resin composition based on polymaleimide and phenolic aralkyl resin | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-02-19 | — | — | EP | disclosed |